Electronics Forum | Tue Apr 13 07:08:34 EDT 2004 | mattkehoe
Dont forget, there is a method for BGA via in pad that is sometimes overlooked. Please look at http://www.sipad.net/sipadvip.htm It works!!!! mkehoe@sipad.net
Electronics Forum | Fri Nov 22 15:59:43 EST 2002 | GSW
What type of reflow profile are you using ? There is a void reduction profile recommeded by some paste manufacturers, Try that it might help. Did you check the components or the board and see if they have absorbed mositure ? try baking the boards and
Electronics Forum | Mon Mar 13 10:45:44 EST 2006 | muse95
The original issue was Co. does not need to go Pbfree, but some BGA's they use are only available Pbfree. They don't want to throw away Pb BGA stock, so some boards might have a combination of both Pb and Pbfree BGAs. The question basically was Shou
Electronics Forum | Fri Aug 02 12:07:50 EDT 2002 | johnw
Richard, your asking a multi million dollar question that in my own opinion no one can give you the right answer since no one really knows. hence I think the lack of answers to your question....thought there would be more people willing to propose a
Electronics Forum | Tue Jun 20 11:31:15 EDT 2006 | muse95
This has been debated several times on this forum, but I have to say the opposite of Samir. I would rather see a SnPb BGA in a Pbfree process(as long as the component can take the heat) than a Pbfree BGA in a SnPb process. There has been some mention
Electronics Forum | Tue Mar 07 14:23:21 EST 2006 | billyd
I think it has a whole lot to do with the heat applied, and the paste type. It was a seriously populated, very thick board, so we had to go big with the heat just to make 240-ish. That produced voids maybe 45 or 50% of the ball size. We knew immediat
Electronics Forum | Sun Apr 25 11:18:45 EDT 1999 | Earl Moon
| Hello all, | | Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not
Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders
Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.
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