Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
: Christian Schwarzer, Fraunhofer ISC " Investigation of the Influence of Voids on the Reliability of Solder Joints by the Finite Element Method " 2016: Paul Vianco, Ph.D
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/underfill
. The smaller form factors and the increased component population continue to shrink keep-out-zone (KOZ) dimensions between CSP/BGA and other board components
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
Modules Microelectronics - Plastic IC Packaging/PEM Microelectronics - Plastic IC Packaging/PEM/BGA Microelectronics - Printed Circuit Board Microelectronics - Smart Card Microelectronics - Stacked Die
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
: An Exercise in Technically Sound Cost Reduction Bruce M. Misner Abstract 29-3 Evaluation of Reworkable Edge Bond and Corner Bond Adhesives for BGA Applications Fei Xie, Han Wu, Kelley Hodge, Swapan K
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
| https://www.smtfactory.com/pcb-x-ray-inspection-machine
: LED BGA Bubble BGA Solder Balls Gold Wire Bounding IC Wire LC Line Semiconductor Mini LED A Closer Look at I.C.T's PCB X-ray Inspection Machines When it comes to PCB X-ray inspection machines
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. B Ball Grid Array (BGA) A surface-mount component containing a processor, and sometimes additional components, where the bottom has a grid of connection points with solder balls attached
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
(e.g. tensile strength, melting temperatures). Area Array Package A surface-mount component with a grid of connection points on the bottom. B Ball Grid Array (BGA
| http://etasmt.com/cc?ID=te_news_industry,24567&url=_print
generation reflow soldering: Vacuum steam condensing welding (vacuum vapor phase welding) system Welding without voids in confined spaces, the heat transfer efficiency is highest (300 W-500W/m2K
