Electronics Forum | Tue Mar 23 14:08:57 EDT 2010 | davef
You have what looks to be blisters/delamination. Use IPC-A-600F as a guideline for acceptance. Usually, we start from the opinion that blisters/delamination as a fabrication issue, even if it appears during solder processing. Often blisters/delam
Electronics Forum | Sun Aug 17 19:06:42 EDT 2014 | natashakt
Hi All, I have been looking in to some failures of PCB's in Assembly. After SMT the boards are stored for different periods of time in high humity environment (72% RH and 21.4 degrees Celsius) before being sent to Assembly to be handsoldered/put thr
Electronics Forum | Thu Sep 04 03:26:18 EDT 2014 | eurekadrytech
Hi all: Interesting question you have raised as it concerns the rate of absorption by the board material. I represent http://www.EurekaDrytech.com and could assist in resolving the blistering problems you're facing. First some questions. 1. Is the
Electronics Forum | Wed Jul 08 20:57:11 EDT 1998 | hyeon-jin Kim
I am looking for a little enlightement with an issue that we have been seeing. We have printed curcuit board with multilayer and HAL finished. After reflow soldering, we have often "blister phenomenon". Our reflow profile is normal. Factory conditio
Electronics Forum | Tue Jan 22 20:27:28 EST 2002 | davef
Doesn't sound good does it? Consider using your field meter to determine the charge level generated in handling these connectors. Then you can determine the impact of the charge generated and the best handling approach.
Electronics Forum | Mon Jun 28 22:30:06 EDT 2004 | davef
If you find it at the end of your process and you find no defects, work on something else. Now if you are a smooth talker and seek a little adventure in life, you might be able to finesse this thing into a road trip to take a tour of your board fa
Electronics Forum | Fri Jul 28 08:46:36 EDT 2006 | davef
Two lines of thought are: * That you have some solder connections points us towards components. It seems like the solderability protection on some components need to have the reflothermal recipe tailored for that component. * Paste selection is a BI
Electronics Forum | Fri Jul 28 08:51:50 EDT 2006 | russ
Are all these defects related to the trace that enters pad? Looking at #2, the good fillet has side trace entry and the bad has front entry. I would suggest that a profile check is in order, then the paste would be next culprit. Russ
Electronics Forum | Fri Jul 28 09:24:54 EDT 2006 | Chunks
Yur profile looks OK for a leaded paste. It may be tyour paste as stated below. Is this a new problem? Also, have you profiled your oven lately? Could be one zone out of control.
Electronics Forum | Fri Jul 28 09:33:14 EDT 2006 | pavel_murtishev
Oven is controlled properly. We run a lot of products at this line. Moreover, same problem appeared at other production line (ovens are different). Yes, problem is new; I never saw this defect before. BR, Pavel
