New Equipment | Industrial Automation
Contact us if the item you are urgent.Often we have large stack to meet you needs ! mailto:unity@mvme.cn Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 . 6 Mo
New Equipment | Test Equipment
SMT Online AOI Machine ZW 810 Inspection Component: 0201 chip PCB size::25x25-480*330mm Dimension:900*950*1600 mm Weight: 650kg Product description: SMT Online AOI Machine ZW 810, Inspection Component: 0201 chip, PCB size::25x25-480*330mm, Di
New Equipment | Test Equipment
SAKI In-line 3D AOI BF-3Di 3D AOI Board size:250×330mm weight:900KG Dimension:850 × 1295 × 1130mm Product description: SAKI In-line 3D AOI BF-3Di, 3D AOI, Board size:250×330mm, Dimension:850 × 1295 × 113
New Equipment | Test Equipment
SAKI On-line 3D AOI BF-3Di 3D AOI Board size:250×330mm Dimension:850 × 1295 × 1130mm weight:900KG Product description: SAKI On-line 3D AOI BF-3Di, 3D AOI, Board size:250×330mm, Dimension:850 × 1295 × 1130m
NPI and Low Volume Desktop Automated Optical Inspection with In-line Performance. MVP's GEM Compact AOI system is a revolutionary tabletop, lightweight inspection solution. MVP is now offering unsurpassed high performance and high resolution capabi
SAKI In-line 3D AOI machine BF-3Di 3D AOI Board size:250×330mm Dimension:850 × 1295 × 1130mm weight:900KG Product description: SAKI In-line 3D AOI BF-3Di, 3D AOI, Board size:250×330mm, Dimension:850 × 1295 × 1130mm, weight:900KG INQUIRY
New Equipment | Test Equipment
This product is NEW USD $6960.00 Megger BITE 2 Megger Model # BITE 2 Catalog # 246002B Battery Impedance Test Equipment Determines condition of lead-acid and NiCd cells up to 7000 Ah On-board Pass/Warning/Fail indications Robust,
SAKI In-line 3D AOI BF-3Di 3D AOI Board size:250×330mm weight:900KG Dimension:850 × 1295 × 1130mm Product description: SAKI In-line 3D AOI BF-3Di, 3D AOI, Board size:250×330mm, Dimension:850 × 1295 × 1130m
The MVP Selecta is a new product designed to complement your selective solder system and allows you to inspect the components soldered by your bottom-side soldering solution. MVP’s Selecta allows for full bottom-side inspection of all wave and reflow
Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
