Electronics Forum | Fri Oct 04 14:11:14 EDT 2002 | franciscoioc
Does any one have a copy of the mpc-29 dehart printer drivers. We our hardrive crushed and we cannot recover this data and we don't have the driver discs
Electronics Forum | Tue Oct 29 08:41:48 EST 2002 | peterpaulmary
from my experience, no clean mean "difficult and cannot clean" Normally, you will observe white residue when cleaning it. You should study the flux in the no-clean solder cream before cleaning it. Or change no clean solder to clean type solder
Electronics Forum | Mon Nov 11 11:43:54 EST 2002 | soupatech
Thanks for the suggestions. I should have been more clear when I said "loose parts". Along with the truly loose parts I have many strips of 50 to 1000 on reels (not marked) and in bags (not marked). I guess if I cannot determine all of the tolerance
Electronics Forum | Mon Dec 16 21:35:46 EST 2002 | grantp
Hi, We tried AIM no clean, and one other paste which I cannot remember the name offhand. We have been using Koki lately, and that's been the best. It seems to leave less residue behind in the stencil. Regards, Grant Petty Blackmagic Design
Electronics Forum | Tue Feb 18 19:07:21 EST 2003 | arturoflores
Our case is not due to thermal pad print squeezing because our shorts are mostly in the outer rows of the BGA so they cannot be caused by central pad printing. We still stick to the BGA thermal pad coplanarity/height hypothesis but have not yet prove
Electronics Forum | Thu Aug 21 10:33:57 EDT 2003 | richardanderson
Has anyone experience in setting up the promon production monitoring software on for the Europlacer machines. I cannot get the server software or viewer software to see the machine. Thanks, Richard
Electronics Forum | Fri Aug 22 09:50:20 EDT 2003 | Mike Snider
I am placing a plastic Cypress, 256 pin BGA on a small assembly, and I cannot stop the corners from bowing. I've moved my profile up and down with no results. Any suggestions?
Electronics Forum | Mon Mar 29 13:33:05 EST 2004 | Ron W
I was wondering if anyone has attempted to develop a process for the successful removal of a BGA and its underfill. Or, is it the general industry thought process that an underfilled BGA cannot be reworked.
Electronics Forum | Fri May 14 17:09:43 EDT 2004 | russ
pete, you forgot the board flipper and the same line duplicated again for two sided boards! and how about an Xray machine after each oven in case the flying probe cannot test all lines?
Electronics Forum | Mon May 17 20:05:41 EDT 2004 | M.L. Feather
Thanks for answering. The only thing I could find on the Universal GSM is the color I want to make the fids (white, black or LED) and the lighting level, (confidence %, In and Out). Other than that I cannot find anything else that will help me change
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