Full Site - : cause of solder balls (Page 8 of 90)

Excellent Drainage Properties of SN100C Confirmed in “Icicle” Test

Industry News | 2011-11-08 12:53:43.0

Nihon Superior is proposing that its “Icicle Test” is one of the criteria electronics manufacturers should consider using as they struggle to find a basis for choosing between the various lead-free solders being offered for wave soldering.

Nihon Superior Co., Ltd.

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Industry News | 2014-07-28 15:50:58.0

Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.

YINCAE Advanced Materials, LLC.

An Innovation Reliability Solution to Interconnect of Flexible/Rigid Substrates

Industry News | 2018-04-09 10:49:39.0

(Albany, NY)– Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.

YINCAE Advanced Materials, LLC.

Nihon Superior to Collaborate with University of Queensland

Industry News | 2008-03-08 04:04:22.0

OSAKA, JAPAN � March 7, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is collaborating with the University of Queensland (Australia) in the investigation of the growth and properties of the intermetallic compounds that form between solder alloys and the soldered substrate.

Nihon Superior Co., Ltd.

Successful Premier of SEHO Academy’s Seminars in the United States

Industry News | 2011-07-13 15:41:41.0

SEHO Systems GmbH announces that its recent seminars in the United States were a success.

SEHO Systems GmbH

Mega Tech of Oregon Installs a KE-1080LN from Juki

Industry News | 2012-08-29 16:15:27.0

Juki Automation Systems, announces that Mega Tech of Oregon (MTO) has begun production with its new KE-1080LN High-Speed Flexible Mounter.

Juki Automation Systems

CeTaQ Highlights the Importance of SPC in SMT

Industry News | 2008-05-03 17:09:31.0

HUDSON, NH � May 1, 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes, announces that statistical process control (SPC) is the key to combining high quality with low costs.

CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)

SMTconnect 2022 - heartbeats of electronic production quicken

Industry News | 2022-05-05 17:10:49.0

SMTconnect, which will take place from 10-12 May in Nuremberg offers a highly relevant program for visitors to the exhibition. With important exhibitors in the industry showcasing their latest developments, the fair provides an opportunity to connect, create and drive technology.

SMTConnect

Highlighting the Strength and Depth of Chinese Electronics Manufacturing

Industry News | 2011-04-20 21:38:55.0

Both local and international electronics manufacturers are aware of the fact that to miss a NEPCON China event is to forego numerous exciting business opportunities. NEPCON China is a trusted barometer of the state of the electronics manufacturing industry in China and Asia.

Reed Exhibitions - RX (Reed Exhibitions)

What's usage of Via tenting for PCB design?

Industry News | 2019-11-05 22:07:01.0

Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.

Headpcb


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