New Equipment | Solder Materials
With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for reflow a
Automated Optical Inspection Machine ZW 625 Dimension:900*1100*1350 mm Max PCB:430x330mm Inspection Component: 0201 chip Weight:Aprox. 450kg Product description: Automated Optical Inspection Machine ZW 625,Dimension:900*1100*1350 mm,Max PCB:430
Automated Optical Inspection Machine ZW 625 Dimension:900*1100*1350 mm Max PCB:430x330mm Inspection Component: 0201 chip Weight:Aprox. 450kg Product description: Automated Optical Inspection Machine,Max PCB: 430x330mm, Inspection Component: 02
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry News | 2022-06-24 10:13:15.0
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
Industry News | 2022-07-16 08:39:50.0
SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.
SAMSUNG Stick Feeder vibration Feeder SMT Spare Parts Samsung feeder SAMSUNG Stick Feeder vibration Feeder Usage: Samsung pick and place machine Product description: China SAMSUNG Stick Feeder vibration Feeder Supplier Manufacturer SAMSUNG
http://www.flason-smt.com/product/Automated-Optical-Inspection-Machine.html Automated Optical Inspection Machine ZW 625 Dimension:900*1100*1350 mm Max PCB:430x330mm Inspection Component: 0201 chip Weight:Aprox. 450kg Product description: Auto
China second hand LED Assembly Line Name: SMT assembly line Usage: PCB production Type: Semi auto Production time: 30 days Product description: China second hand LED Assembly Line INQUIRY China second hand LED Assembly Line Pro
