Technical Library | 2019-06-05 11:11:06.0
As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages.
Technical Library | 2019-08-08 10:23:51.0
High mix production is the mainstay of many electronics assembly plants. Lot sizes and board complexities vary and the boards are often mixed technology, comprising a blend of both surface mount and through-hole technology. Modularizing a production line enables a clear distinction between one type of assembly process and another. This article assumes a modern factory where a job can be routed to the selective soldering machine module, the hand assembly bench, or a combination of both. The decision rules of routing a circuit board through hand assembly versus automated selective soldering are discussed. Hand assembly soldering operations require no explanation.
New Equipment | Cleaning Equipment
In-line technologies in a batch footprint. Today’s challenges for PCB manufacturers hinge on high density, increasing complexity, and miniaturization. Manufacturers who currently clean with batch-type cleaners are looking for a solution
Unsurpassed cleaning, high-efficiency drying, low cost of ownership, ease of maintenance, and minimum downtime all come together in the ELECTROVERT Aquastorm, a world-class printed circuit board cleaning system. As high-reliability PCBs become minia
Safe, precision rework for SMD, BGA, and other high value chips The versatile SV560A rework station combines precision, reliability, and affordability in an all-in-one solution for all your rework needs, from complex, densely populated PCBAs to simpl
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
Automatic online glue dispenser HMH830D 1. X, Y, Z three-axis motion, accurately realize the selective spraying process of various circuit boards to avoid non-coated areas such as connectors. 2. Accurately realize the selective area spraying of vari
Precise coating discrete dots with the DispenseJet DJ-9500. http://www.nordsonasymtek.com
Events Calendar | Tue Aug 11 00:00:00 EDT 2020 - Tue Aug 11 00:00:00 EDT 2020 | ,
SMTA/iNEMI Webinar: Non-Contact Additive Processes for Contemporary Electronics Production
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
