Electronics Forum: conditions (Page 8 of 123)

Re: Poor soldering on Motorola 357 PBGA

Electronics Forum | Mon Nov 06 10:52:52 EST 2000 | Glen Mantych

Glenn, we have been fighting perhaps the identical problem for nearly a year on a 1mm pitch BGA, we have performed numerous laboratory analyses of defective joints and virgin parts in an effort to specifically identify the cause of the no-wet joints.

Re: IC plastic encapsulant family

Electronics Forum | Wed Jun 07 21:07:07 EDT 2000 | Dave F

Ooooops, I messed that up!!!! It should read: Point well taken John. Expanding on epoxies: Novolac is a multifunctional epoxy ... a phenolic resin. Most phenolic resins are made using phenol (P) and formaldehyde (F). They comprise the bulk of

Moisture sensitive components (MSC)

Electronics Forum | Tue Feb 20 04:18:39 EST 2001 | chinaman

Hi everyone if once the exposure time is exceeded the only option is to bake the components. I learned there is an "old spec" for the baking conditions (24h/125C or 192h/40C) and a "new spec" which is the current standard specifying conditions of 4

Re: Solder Connection Environmental Screening

Electronics Forum | Wed Aug 23 16:18:47 EDT 2000 | Dr. Ning-Cheng Lee

I presume you are referring to vibration test with fixed frequency at room temperature. One procedure describing the detailed profile is in MIL-STD-883E, Method 2005.2 (12/31/96). The approximate profile can be described as 60Hz, 20-70g, and 96 hrs t

Printing problem MPM AP25

Electronics Forum | Fri Aug 03 16:46:59 EDT 2001 | davef

It's OK to have a thin film or haze of paste left on the stencil. Printing nice bricks of paste is the important thing. Assuming you know these things, so tell us more about your situation. PRINT QUALITY: What do your paste deposits look like?

Re: Noclean soldering to gold

Electronics Forum | Sat Dec 04 09:33:18 EST 1999 | Christopher Lampron

Hello Russ, I believe that the dullness in color of the solder joint is related to the gold finish on the pads. I have had done alot of thru hole soldering of gold pins as well as SMT on gold finish and have seen the condition that you are talking a

Re: stencil condition

Electronics Forum | Thu Jan 07 16:40:26 EST 1999 | MMurphy

| | What kind of equipment are you using to gauge the thickness of your stencil after it's used for some months? How to determin the condition of the stencil? Your input is much appreciated. | | | | Ken Mok, based in Shenzhen, China. | | | | | |

Re: stencil condition

Electronics Forum | Sat Jan 09 16:01:18 EST 1999 | Jason Hall

| What kind of equipment are you using to gauge the thickness of your stencil after it's used for some months? How to determin the condition of the stencil? Your input is much appreciated. | | Ken Mok, based in Shenzhen, China. | | Ken, I have neve

force between the pad and laminate material

Electronics Forum | Mon Jun 17 13:45:29 EDT 2002 | genny

When the pad comes off, is it leaving behind a "black" area? Your board may be suffering from black pad - a condition that occasionally affects ENIG finish boards. It is a process control issue with your board fabricator. The nickel is oxidising b

DEK288 Machine's

Electronics Forum | Thu Aug 22 04:08:17 EDT 2002 | Jason Baldwin

Symptom: Board Stuck on Print Conveyor error messages. Cause: Board not flagging the camera sensor. Remedy: Check the following items: � Check the camera sensor can see the board underneath. � Check the camera sensor calibration (in Tools, Camera Re


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