New Equipment | Industrial Automation
Select the right products & services to meet your needs! PLeases contact us Email:unity@mvme.cn Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Product： Quali
New Equipment | Assembly Services
Rigid PCB SERIAL ITEM TECHNICAL DATA 1 Types of Products HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB，FPC, Teflon Board
Industry News | 2022-04-28 15:05:22.0
In times of climate change and increases in energy use, the demands of power modules for the efficient and reliable control of electric motors continue to rise. Modern module concepts are reaching their limits in terms of power density, current carrying capacity, and reliability to increase lifetime and reduce costs. A critical area for improving power modules is the material system used in them, as well as their electrical and thermal interconnection.
Parts & Supplies | Circuit Board Assembly Products
1) 160*100mm, FR-4 CTI ≥ 600V 2) 8 layer impedance control 3) Copper weight(finished inner/outer): 1 oz 4) LPI Green mask/white silk 5) Min hole 0.19mm, 5/3 track/gap 6) 1.6mm +/-10% thick 7) Immersiong gold over nickel
Technical Library | 2008-11-20 00:46:10.0
The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy.
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Tg170, Lead-free, Low Z-axis CTE, Low water absorption. 2). Excellent thermal stability and anti-CAF performance 3). 2-30 layer, 1.6mm thick 4). 1 oz copper finished 5). 10% impedance control 6). Immersion gold, HASL LF. 7). Suitable for hig
New Equipment | Fabrication Services
Heavy copper technology is one of the solutions to reach the needs of modern power electronics, and heavy copper printed circuit boards are the latest trend in PCB industry. Heavy copper PCBs are highly used for high power and current applications in
Industry Directory | Manufacturer
Sprint Circuits,a high technology PCB manufacturing company,Since 2001.Our advantages are quick turn,Thick copper(up to 6oz) ,impendace control and high precision from 6layer to 12layer boards.
Technical Library | 2009-02-13 12:29:39.0
To meet the market demand for a best-in-class, low-cost leadfree alloy for wave, selective and dip soldering
Technical Library | 2020-09-02 22:14:36.0
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The printed circuit board (PCB) must support this trend as the central interconnection of the system. There are several options for fine line circuitry. A typical fine line circuit PCB product using copper foil technology, such as the modified semi-additive process (mSAP), uses a thin base copper layer made by pre-etching. The ultrathin copper foil process (SAP with ultrathin copper foil) is facing a technology limit for the miniaturization due to copper roughness and thickness control. The SAP process using sputtered copper is a solution, but the sputtering process is expensive and has issues with via plating. SAP using electroless copper deposition is another solution, but the process involved is challenged to achieve adequate adhesion and insulation between fine-pitch circuitries. A novel catalyst system--liquid metal ink (LMI)--has been developed that avoids these concerns and promotes a very controlled copper thickness over the substrate, targeting next generation high density interconnect (HDI) to wafer-level packaging substrates and enabling 5-micron level feature sizes. This novel catalyst has a unique feature, high density, and atomic-level deposition. Whereas conventional tin-palladium catalyst systems provide sporadic coverage over the substrate surface, the deposited catalyst covers the entire substrate surface. As a result, the catalyst enables improved uniformity of the copper deposition starting from the initial stage while providing higher adhesion and higher insulation resistance compared to the traditional catalysts used in SAP processes. This article discusses this new catalyst process, which both proposes a typical SAP process using the new catalyst and demonstrates the reliability improvements through a comparison between a new SAP PCB process and a conventional SAP PCB process.
