solder paste Sn63/Pb37 solder paste Sn63/Pb37 Tin solder paste Sn63/Pb37 Tin solder paste Sn63/Pb37 Product description: solder paste Sn63/Pb37 INQUIRY solder paste Sn63/Pb37 Machine Details: Brands QiSMT
Technical Library | 2021-09-08 13:43:56.0
Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s.
Industry Directory | Manufacturer
Caring Circuit specialises in the supply of prototype, small and medium-series PCBs factory in Shenzhen,China.We are a leading provider of custom Single layer,double layer,multilayer rigid PCBs.
MDE Semiconductor, Inc. is a market leader in Circuit Protection Products.
CNC bronze working parts China Best Machined Co., ltd specializing in all kinds of CNC brass machining parts professionally for more than 20 years, Products are widely used in electronics, hardware, bycycle, motorcycle, automobile, telecommunication
Technical Library | 2017-06-13 17:14:59.0
For tin-rich solder alloys, 200 C (392 F) is an extreme temperature. Intermetallic growth in tin-copper systems is known to occur and is believed to bear a direct relationship to failure mechanisms. This study of morphological changes with time at elevated temperatures was made to determine growth rates of tin-copper intermetallics. Preferred growth directions, rates of thickening, and notable changes in morphology were observed.Each of four tin-base alloys was flowed on copper and exposed to temperatures between 100 C and 200 C for time periods of up to 32 days. Metallographic sections were taken and the intermetallics were examined. Intermetallic layer thickening is characterized by several distinct stages. The initial growth of side plates is extremely rapid and exaggerated. This is followed by retrogression (spheroidization) of the elongated peaks and by general thick-
Industry Directory | Manufacturer
Zen Kor Circuit Technology Co., Ltd is a professional Multilayer PCB manufacturer, specializing in quick-turn prototype and small-medium volume.
The innovative inline soldering system for mass producers operate according to oxygen free process designed by ASSCON. Preheating and soldering is performed under oxygen free conditions. Components such as QFPs, BGAs, Flip-Chip and hybrids are proces
New Equipment | Cable & Wire Harness Equipment
NTC thermistor housed in hex head M6 threaded nickel plated copper housing. O-ring can be supplied together for better sealing. Easy mounting with M6 Nut Immersion NTC thermistor temperature sensor, can be placed directly in the water flow, in dir
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
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