Electronics Forum | Mon May 18 20:57:06 EDT 1998 | Earl Moon
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get in
Electronics Forum | Mon May 18 22:54:04 EDT 1998 | Dave F
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. | | As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get
Electronics Forum | Tue Dec 01 07:24:44 EST 1998 | Earl Moon
| Hi folks , | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspection
Electronics Forum | Tue Dec 01 07:54:49 EST 1998 | kallol chakraborty
| | Hi folks , | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspec
Electronics Forum | Thu Feb 18 22:49:49 EST 1999 | Chris G.
| We are using .040" diameter fiducials (global and local) on our boards. They are solder covered and HASL. I get batches of boards where the p&p vision system has trouble reading the fiducial. The fiducial looks dark on the screen. The board ven
Electronics Forum | Tue May 31 10:44:16 EDT 2005 | Scott B
We have found that when the HASL thickness is less than 5 microns the tin in the HASL reacts with the copper leaving a SnCu surface with poor solderability and microscopic grainy Pb islands. The IPC does not specify minimum HASL thickness but we now
Electronics Forum | Mon May 29 23:39:11 EDT 2006 | Faizal
Can anyone advice me on the effect of SN100C wave solder on SAC305 hasl board? I suppose the silver content on the hasl pcb would leech(contaminate) into solder pot.? Would it affect the surface bonding between copper pad and the solder.?
Electronics Forum | Fri Nov 17 14:36:17 EST 2006 | Fer
Good afternoon all, There is an issue in my company regarding flatness on SMDs. The part I am fabricating is a multilayer assembly of .175" by .175" by .049" thick. The part is made out of a multilayer copper clad PTFE with a tin finish surface. Af
Electronics Forum | Mon May 15 13:05:31 EDT 2017 | edhare
Pin holes in the gold can allow for corrosion of the underlying nickel and copper to form copper and nickel oxides on the gold surface (example - http://www.semlab.com/blog/?p=564. The corrosion can work itself all the way through the EN layer (exam
Electronics Forum | Fri Jul 30 10:30:23 EDT 1999 | Wolfgang Busko
| | | While inspecting incoming PCBs we detected around all plated-through-holes (only there and all in the same place) some halfmoonshaped light rings that match obviously only with the pink ring symptom shown in the IPC-A-600 chapter 2.5.2.. That w
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