Electronics Forum | Thu Jul 15 15:16:26 EDT 2010 | leemeyer
I am looking into pick and place machines that are spec'd to place 01005 components. Does anyone know of a inexpensive make(50 - 75K $ new) that can place these parts. So far all that I have found are 150K and up. Thanks
Electronics Forum | Fri Sep 23 16:42:59 EDT 2022 | kurtiss
It is a 2011 XPRT5 with Software version ESP001-413 2010-08-04.0. The chassis appears to be the same as an X4.
Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj
Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks
Electronics Forum | Mon Jun 20 10:59:18 EDT 2005 | Jason Fullerton
Extra cooling is better (Alpha recommends -3 to -7 degC/sec) for cosmetics. Less chance of s o called 'cooling lines' that look similar to 'cold' tin-lead joints. (Seems a bit steep to me - I worry about the risk of cracking ceramic caps.) Might be
Electronics Forum | Fri Jan 29 11:23:54 EST 2010 | ppwlee
Smtnet, I am looking at pros and cons for automated soldering. The application is a simple multi pin through-hole soldering on a high volume manual assembly line. The goal was to eliminate defects associated with missing solder pins which goes undet
Electronics Forum | Tue Feb 09 13:47:46 EST 2010 | davef
BGA rework equipment: Search the fine SMTnet Archives to find threads like: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=48736 Use x-ray inspection to identify the obvious defects such as shorts, missing balls and gross solder voids.
Electronics Forum | Tue Feb 23 12:56:03 EST 2010 | vleasher
Is there any harm in washing SMT soldered with NoClean paste? The PCA has some large thru-hole connectors that we would prefer to do as water soluble on out selective solder but the SMT consists of LGA's and other low parts that we would not be able
Electronics Forum | Wed Feb 24 07:28:40 EST 2010 | drt
Agree with what has been said so far. Check with your end customer and make sure the white haze appearance of the board will be acceptable. You will never get the board to look like it did before you started. It may be clean but it won't look like t
Electronics Forum | Wed Feb 24 10:23:04 EST 2010 | xps
60° C). Moreover (by IPC standard)... "White residues resulting from no-clean or other processes are acceptable provided the residues from chemistries used have been qualified and documented as benign...". So, use an EDX or IC analysis in order to
