Electronics Forum | Wed Mar 19 19:02:39 EST 2003 | Jodi Roepsch
From my experience, we have had little success in reworking boards with the black pad condition. In one instance, with several reworks, we were able to get plated through holes with the defect to take solder but the joint reliability was highly ques
Electronics Forum | Thu Nov 27 21:25:15 EST 2003 | Al Capone
Has anyone in this forum experience the can soldering defect? The can component is supposed to be placed on top of a group of RF components to protect the frequency from escaping and interfere with the adjacent RF component. After the reflow process,
Electronics Forum | Wed Feb 12 17:41:18 EST 2003 | MA/NY DDave
Hi, Gee David F is as bad or as good as me on a bad day. Boy can I get mad... "new information" Many of these defects have been around so dang long and seem to get recycled as the latest rage and the newest of new information in technical articles
Electronics Forum | Wed Feb 12 08:46:13 EST 2003 | dphilbrick
Get the January 2003 issue of Circuits Assembly Mag. It has more than you could ever want to know about this topic.
Electronics Forum | Wed Feb 12 17:32:53 EST 2003 | MA/NY DDave
Hi And Thanks. I couldn't find it with the link you gave. And I don't have my magazine with me. I love a click that gets me RIGHT THERE YiEng, DDave
Electronics Forum | Thu Feb 13 09:34:33 EST 2003 | genny
Did it take you to the magazine website? Just scroll down to where it says magazine on the left side, choose past issues and pick January. I think it was the featured article. Or try this to go right to that article. http://www.circuitsassembly.com
Electronics Forum | Tue Mar 11 13:50:23 EST 2003 | MA/NY DDave
Hi David F, You are GREAT!! You must have read my mind by posting this notice so our intial responder can tune in if she so wishes. YiEng, MA/NY DDave
Electronics Forum | Mon Mar 17 15:51:35 EST 2003 | MA/NY DDave
Hi A GREAT come back!! After a Wait to see "Show and Tell" To change the topic you launched a little. Who has or has had, this ENIG problem??? A simple yes or no with some detail. YiEng, MA/NY DDave
Electronics Forum | Wed Mar 19 09:59:45 EST 2003 | davef
Jodi What's your thinking on the black pad rework technique proposed in: �A Failure Analysis And Rework Method �� Z. Mei, et al, SMTA International 1999, p407
Electronics Forum | Thu Mar 20 07:26:22 EST 2003 | davef
Jodi We too have had little success with the approach described in the referenced paper. What method do you use?
