Industry News | 2021-10-07 15:10:50.0
KIC will exhibit in Booth #3101 at SMTA International, scheduled to take place Nov. 3 - 4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. Along with Reflow Process Inspection (RPI) and Wave Solder Process Inspection (WPI), the KIC team will discuss NPI setup, process optimization for reduced defects, improved OEE, and their complete ecosystem of solutions for thermal processes.
Industry News | 2022-04-13 10:14:24.0
KIC will exhibit in Hall 4, Stand 452 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg. KIC are thermal process experts who make ovens smarter. Along with Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking, and their complete ecosystem of solutions for thermal processes.
Industry News | 2018-04-24 08:14:27.0
Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, announces that PAC Global Inc. and Competitive Edge Manufacturing Equipment (CEME) have joined the Saki America team in the Southern United States and Mexico. The companies are representing Saki's complete line of 2D and 3D automated solder paste, automated optical, and automated x-ray (SPI, AOI, and AXI) inspection and measurement systems and software and Saki's Smart manufacturing, Industry 4.0, and machine-2-machine initiatives.
Industry News | 2014-04-16 13:17:25.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce they will exhibit in Booth # B-1F25 at NEPCON China, scheduled to take place April 23-25, 2014 at the Shanghai World Expo & Exhibition Convention Center (Hall 1) in Shanghai, China.
Technical Library | 2023-02-13 18:56:42.0
This paper describes the results of an intensive whisker formation study on Pb-free assemblies with different levels of cleanliness. Thirteen types of as-received surface-mount and pin-through-hole components were cleaned and intentionally contaminated with solutions containing chloride, sulfate, bromide, and nitrate. Then the parts were assembled on double-sided boards that were also cleaned or intentionally contaminated with three fluxes having different halide contents. The assemblies were subjected to high-temperature/high-humidity testing (85_C/85% RH). Periodic examination found that contamination triggered whisker formation on both exposed tin and solder fillets. Whisker occurrence and parameters depending on the type and level of contamination are discussed. Cross-sections were used to assess the metallurgical aspects of whisker formation and the microstructural changes occurring during corrosion.
Industry News | 2013-02-14 13:04:45.0
ASC International announces that it will demonstrate its VisionPro AP500, AV862 AOI and SAKI AOI systems in in Booth #2801 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.
Industry News | 2010-08-02 10:19:18.0
National Physical Laboratory NPL have announced initial results from their PCB assembly surveys to support a recently launched Industry Defects Database http://defectsdatabase.npl.co.uk/
Industry News | 2020-02-11 04:22:16.0
Providing process information and solving process defects is what I have been doing for many years with different organisations. In addition we have in the past created reports on 0201 assembly and testing of PCB surface finishes for lead-free assembly
Industry News | 2012-08-21 20:28:27.0
SolderLab.comintroduces the SolderLab ROI Calculator – Cost of Rework Calculator.
Industry News | 2015-02-16 06:32:38.0
We offer the widest range of Photo CD-ROMs which provide process, quality engineers, marketing or editorial staff with a unique source of photographs which may be used in company inspection documents, technical presentations and websites
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