Electronics Forum: design guidelines (Page 8 of 32)

Stenciling chipbonder.....

Electronics Forum | Wed Jan 22 15:22:53 EST 2003 | davef

Hey "Dispenser Boy" does this mean we can have your machine? ;P I'll be out to supervise the packing with a Hook in my hand. Poke around the fine SMTnet Archives to get started on aperture design. 7525, Stencil Design Guidelines is pretty much of

SMT Stencil Design

Electronics Forum | Thu Feb 15 17:08:34 EST 2018 | davef

IPC-7525A - Stencil Design Guidelines http://www.ipc.org/TOC/IPC-7525A.pdf

Re: 16 mil pitch QFP solder bridge

Electronics Forum | Mon Oct 09 19:56:41 EDT 2000 | Dave F

CJ: Arturo and the others make good suggestions. Consider: IPC-7525 Stencil Design Guidelines

Solder paste amount

Electronics Forum | Tue Jan 16 21:00:11 EST 2001 | davef

Two good sources of information are: 1 IPC-7525 Stencil Design Guidelines 2 SMTnet fine Archives [once the guys get them back up and running after the conversion is complete]

Glue Stencil Design Guidelines

Electronics Forum | Fri Aug 30 17:43:34 EDT 2002 | davef

Search the fine SMTnet Archives to get started. We use 'glue' 'epoxy' 'adhesive' [without the ' of course] interchangeably.

Fine pitch paste release problems.

Electronics Forum | Mon Dec 16 13:33:09 EST 2002 | pjc

square apertures provide better paste release than round in most applications. See IPC 7525 Stencil Design Guidelines

IPC-2252 Design guideline for RF/Microwave PCBs

Electronics Forum | Wed Apr 23 22:06:46 EDT 2003 | davef

Download it from IPC.org. About as a fast as you can get. They overnight it to you, also.

PBGA vias throwing solder balls

Electronics Forum | Sat Sep 18 08:26:10 EDT 2004 | davef

Carol: If you would have problems both covering the via and keeping mask from the BGA pads, maybe you via are too close to the pads. Maybe some of the IPC pad design guidelines would help.

Tented vias on ENIG boards

Electronics Forum | Tue Jan 31 15:44:08 EST 2006 | John S.

We're looking at lead free surface finishes for some of our products. On one supplier's site, I found a note that tenting vias on ENIG boards can lead to the black pad phenomenon. How does this compare to your design guidelines and experience? Than

Thermal screening for marginal BGA joints

Electronics Forum | Sat Nov 03 09:29:17 EDT 2007 | davef

IPC-9701, SMT Solder Joint Reliability Qualification and Performance Standard is an update of D-279, Design Guidelines For Reliable SMT PCA that includes BGA and PbFree


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