Electronics Forum | Thu Jun 09 20:48:07 EDT 2016 | deanm
I'm assuming these are two leaded axial components. GPD Global makes fluid dispensing and component prep equipment. Component leads can be formed (or bent) in order to provide some resistance in the hole during insertion. This should prevent the comp
Electronics Forum | Wed Feb 07 09:57:38 EST 2001 | caldon
I used a Die feeder from Delaware Technologies for our Quad machine. We have not had Quad in our factory for over a year now so most of my knowledge is geared towards the older Quads. Don Dawson at Delaware Technologies can help. 609-235-8454. I am c
Electronics Forum | Thu Nov 26 03:59:50 EST 1998 | Chi-Ting Chen
I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cause
Electronics Forum | Thu Nov 26 06:07:40 EST 1998 | Earl Moon
| I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cau
Electronics Forum | Fri Nov 27 02:09:50 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Sat Jun 15 22:49:23 EDT 2002 | edahi
well as usual this for flip chip however, this application uses ceramic substrates and the nearby area in which the splatter land on is the marking area (gold pad). We cannot hide this because the package is completed bare die, meaning no heatspread
Electronics Forum | Thu Mar 27 16:40:45 EDT 2008 | slthomas
(or just some static-safe foam tape) I need to seal a wire terminal block to a board for conformal coating purposes. Currently we glue it to a shim and glue the shim to the board (yuck), but I want to use die cut gaskets if I can make it cost effec
Electronics Forum | Sun Jan 24 20:11:45 EST 2010 | wmeliane
Hi I would like to get feedback on which of the following 2 machines to buy: -option 1: My100 with single Midas head -option 2: D1S with single P&P head I have experience with the Siemens D series. However I have no real experience with Mydata... Is
Electronics Forum | Wed Jan 27 11:22:51 EST 2010 | fredc
Hello TQS, We have made Micro Mechanics adapters for Mydata. The Micro Mechanics tips are used in die bonding machines. I have no doubt that an adapted nozzle would hold your die securely. From Grants posts in the past, he had problems with placement
