Full Site - : diode marked 5d (Page 8 of 18)

Microscan Introduces Visionscape� Smart Camera to Electronics Industry

Industry News | 2009-04-27 17:56:19.0

RENTON, WA � April 2009 � Microscan, a global technology leader for precision data acquisition and control solutions, announces the new Visionscape� Smart Camera that combines technologies from machine vision and auto ID into a singular PCB inspection solution that is powerful, low-cost, and easy to use.

Microscan

Microscan to instruct machine vision courses and demonstrate products at The Vision Show

Industry News | 2010-05-20 14:34:30.0

RENTON, WA — Microscan, a global technology leader for track and trace solutions, announces the instruction of two educational machine vision courses and product demonstrations at The Vision Show. The Vision Show is organized by the Automated Imaging Association (AIA) and is scheduled to take place May 25–27, 2010 at the Hynes Convention Center in Boston.

Microscan

Nihon Superior to Showcase the Newest Addition to the SN100C Lead-Free Solder Series at the 2012 IPC APEX Expo

Industry News | 2012-01-21 16:28:10.0

Nihon Superior will introduce the newest addition to its SN100C lead-free solder series in Booth #3044 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

Nihon Superior Co., Ltd.

Eyepoint p10

Eyepoint p10

Videos

Overview of EyePoint P10 system

Engineering Physics Center of MSU

Juki Automation Systems to Display KE-2060RL with IFS-X2 at Nepcon East 2007

Industry News | 2007-10-26 13:08:43.0

MORRISVILLE, NC - October 24, 2007 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will highlight the KE-2060RL High-speed Fine-pitch Assembler with IFS-X2 in booth 615 at the upcoming Assembly New England/Nepcon East exhibition and conference scheduled to take place October 30-31, 2007 at the Boston Convention & Exhibit Center.

Juki Automation Systems

AI Technology, Inc (AIT) To Attend and Present Paper at IWLPC. AIT also attending IPC/SMTA High-Reliability Cleaning and Conformal Coating Conference.

Industry News | 2014-11-07 10:35:14.0

AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.

AI Technology, Inc. (AIT)

SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China

Industry News | 2017-08-10 17:43:56.0

Nihon Superior Co. announces its Nihon Superior Shanghai subsidiary will exhibit in Booth #1G08 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305.

Nihon Superior Co., Ltd.

Inspect Wafers Straight from the FOUP with the New Nordson DAGE Quadra® W8 Automated Wafer X-ray Inspection System

Industry News | 2018-10-09 18:44:45.0

Nordson DAGE announces the launch of Quadra® W8, a versatile lab-based solution for wafer-level inspection offering industry-leading magnification and image quality. Integrated dual port EFEM provides complete wafer protection by removing any manual wafer handling so operators can inspect wafer level quality directly from the FOUP.

Nordson DAGE

Inspect Wafers Straight from the FOUP with the New Nordson DAGE Quadra® W8 Automated Wafer X-ray Inspection System

Industry News | 2018-10-09 18:44:51.0

Nordson DAGE announces the launch of Quadra® W8, a versatile lab-based solution for wafer-level inspection offering industry-leading magnification and image quality. Integrated dual port EFEM provides complete wafer protection by removing any manual wafer handling so operators can inspect wafer level quality directly from the FOUP.

Nordson DAGE

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at NEPCON Japan

Industry News | 2015-12-28 17:22:37.0

Nihon Superior will exhibit in East Hall 1 E3-18 at NEPCON Japan, scheduled to take place Jan. 13-15, 2016 at the Tokyo Big Site in Japan. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Co., Ltd.


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