Parts & Supplies | X-Ray Inspection
CT81 HV Disc Ceramic Capacitor 2KV~50KV, 10pf~50000pf CT81 High Voltage Disc Ceramic Capacitor, High Voltage Disk Ceramic Capacitor, HV disc ceramic capacitor, 20KV radial disc ceramic capacitor, 30kv axial ceramic capacitor, 50kv axial disc ceramic
Parts & Supplies | X-Ray Inspection
CT81 HV Disc Ceramic Capacitor 2KV~50KV, 10pf~50000pf CT81 High Voltage Disc Ceramic Capacitor, High Voltage Disk Ceramic Capacitor, HV disc ceramic capacitor, 20KV radial disc ceramic capacitor, 30kv axial ceramic capacitor, 50kv axial disc ceramic
Career Center | Murphy, North Carolina USA | Engineering
We are seeking a qualified and experienced senior design engineer to join our team. The best candidate will use both mechanical and electrical engineering skills to design innovative power supplies that are highly efficient, rugged, and have high rel
Technical Library | 2014-02-27 15:30:20.0
Silicon dioxide is normally used as filler in underfill. The thermal conductivity of underfill is less than 1 w/mk, which is not able to meet the current flip chip application requirements such as 3D stacked multi-chips packaging. No matter which direction the heat will be dissipated through PCB or chip, the heat has to pass through the underfill in 3D stacked chips. Therefore the increase of thermal conductivity of underfill can significantly enhance the reliability of electronic devices, particularly in 3D package devices
Technical Library | 2014-07-17 17:01:10.0
Embedded computing systems used in many military and avionics applications are trending toward higher heat fluxes, and as a result performance is being hindered by thermal limitations. This is intensified by the high ambient conditions experience by today’s modern warfighter. In many applications liquid cooling is replacing air flow through chassis for both thermal and environmental benefits(...) This paper outlines a series of passive thermal improvements which are easily integrated into legacy, or existing, systems and can provide a 3-4x increase in dissipated power.
Technical Library | 2019-05-01 10:07:37.0
Adhesive bonding involves the use of adhesive to form a material bond between two or more assembly parts. In addition to regular adhesive bonding applications, hybrid processes, in which the adhesive bond includes another function such as sealing or heat dissipation, are gaining importance. Traditional joining methods such as welding or bolting are progressively being replaced in industrial applications by efficient adhesive bonding processes, since these processes provide a number of advantages such as part weight reduction or simplified parts handling.
Technical Library | 2021-03-24 01:30:47.0
Power electronics technology is widely used in several areas, such as in the railways, automotive, electric vehicles, and renewable energy sectors. Some of these applications are safety critical, e.g., in the automotive domain. The heat produced by power devices must be efficiently dissipated to allow them to work within their operational thermal limits. Moreover ...
Technical Library | 2022-09-29 14:08:42.0
Electronic vehicles, devices and components must not overheat, otherwise they may fail to operate correctly. Thermal management is a major technical challenge as components are getting smaller, power densities are increasing and demands on robustness and reliability are becoming more stringent. To prevent power losses or defects resulting from overheating, liquid thermal interface materials (TIMs) are being increasingly used to dissipate their heat. This White Paper discusses the aspects that need to be taken into account when dispensing these mostly highly viscous, highly abrasive materials and why in many cases they are better alternatives to pads, tapes and foils.
The Polyonics polyimide tapes combine the unique electrical, thermal, chemical and mechanical properties found in polyimide with Polyonics proven coating, adhesive and manufacturing technologies. The tapes maintain these excellent properties over a w
Industry Directory | Consultant / Service Provider
We specialize in thermal management consulting and R&D services for the electronics /telecommunications industry. We guarantee you personalized service, attention to detail, and the shortest turnaround time, world-wide.
