Electronics Forum | Sat Jun 28 08:17:21 EDT 2003 | davef
We form a barrier to contain the dye, but regardless it is messy. Actually, we no longer use dye, per say. We use the stuff machinists use for staining metal. Look here for hints: * http://www.ivf.se/Elektronik/dye_penetrant/edefault.htm * http:
Electronics Forum | Wed Oct 23 05:02:38 EDT 2002 | nifhail
Guys what is the diff. between Dye Pry test vs cross sectioning, and how is it done ? Thank you..
Electronics Forum | Wed Oct 23 08:59:25 EDT 2002 | davef
Not familiar with "Dye Pry test".
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Mon Apr 06 09:04:31 EDT 2015 | jesseoliveira
Hi all! I work in FA Lab on Brazil. Recently we had a problem with a dye pry analysis of BGA component due to breakage of WLP package (wafer level packaging). In this case, WLP thickness is about 0.28mm and was damaged during pullout process. Our
Electronics Forum | Mon Feb 08 16:11:10 EST 2010 | glennster
Dave, I agree totally, but dye-and-pry should also be part of the evaluation. Glenn Robertson Process Sciences Inc
Electronics Forum | Thu Aug 14 17:37:11 EDT 2008 | bandjwet
Dear Smtnettter: Has anyone purchased yellow visible colored dye penetrant for dye and pry testing? Can someone recommend a vendor? BTW this was recommend to me by an end user in japan as some copper problems are "hidden" by the typical red visible
Electronics Forum | Fri Aug 19 02:16:40 EDT 2011 | ppcbs
In my opinion destructive methods went out with the stone age. At least they did at our company. We specialize in non-destructive defect analysis. We can determine where the failure is i.e. assembly process, fab defect, BGA defect or plating proce
Electronics Forum | Mon Aug 15 18:42:53 EDT 2011 | bandjwet
Does anyone have experience in doing dye and pry analysis on PoPs? A customer wants to know whether or not the board level or device-device interconnect is the suspect. What other technique can anyone recommend? BWET
Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a
C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.
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