785 effects of package warpage on head-in-pillow defect results

Express Newsletter: effects of package warpage on head-in-pillow defect (Page 8 of 79)

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SMT Express, Volume 2, Issue No. 6 - from SMTnet.com

array (BGA) and chip scale package (CSP) manufact


effects of package warpage on head-in-pillow defect searches for Companies, Equipment, Machines, Suppliers & Information

Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411