Tungsten and Tungsten Alloy Bars&Rods Alloy Bar W1 ����2.0 CW1 ��2.0-5.0 W2 ����2.0 WAl1 ��2.8-11.0 WAl2 ��2.8-11.0 WAl3 ��2.8-11.0 WCe15 ��1.0-10.0 WTh7 ��0.8-2.8 WTh10 ��2.8-10.0 WTh15 ��2.8-10.0 Wl10 ��2.8-10.0 W-Ni-Fe ����5.0 W-Ni-
Used SMT Equipment | General Purpose Test & Measurement
We ship worldwide. Please feel free to contact us if you need further information. EXFO FTB-500 Platform and FLS-5834A CD/PMD Analyzer Source Connects anywhere: USB, 3G, Wi-Fi, VPN and Bluetooth Loaded with utilities: all the tools required to
Paragon Innovations, Inc. is a leading provider of design services having experience in designing embedded systems in several industries including medical, Internet, telecommunications, automotive, military, retail electronics and PDAs. Paragon desi
Paragon Innovations, Inc. is a leading provider of design services having experience in designing embedded systems in several industries including medical, Internet, telecommunications, automotive, military, retail electronics and PDAs. Paragon desi
Tessent combines features of deterministic scan testing, embedded pattern compression, built-in self test, specialized embedded memory test and repair, and boundary scan, as well as board and system-level test technologies. The Tessent product suit
Technical Library | 2016-06-16 15:29:31.0
Embedding components within the PC board structure is not a new concept. Until recently, however, most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable, many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance, companies have found that by reducing the component population on the PC board's surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the closer coupling of key elements can also contribute to improving functional performance.This paper focuses on six basic embedded component structure designs described in IPC-7092.
New Equipment | Test Equipment
One platform for debug and trace (SourcePoint™) SourcePoint™ (formerly an Arium product) is a platform of debug and trace tools for C/C++ embedded software and firmware for either Intel® or ARM® systems. This robust environment features multiple vie
Dual Operation An advanced compact digital controlled production soldering and SMD component rework system, suitable for high-capacity soldering and temperature-regulated installation and removal of PLCC/SOIC types, together with chip resistors and
New Equipment | Test Equipment
LCR-Reader-MP is a multipurpose device for testing SMT and debugging PCBs. This model offers the highest basic accuracy of 0.1% and the most features of all Smart Tweezers and LCR-Reader devices, including test modes such as diode/LED testing, freque
New Equipment | Tape and Reel Equipment
ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment. The preform is placed directly into the solder paste prior to assembly reflow. Alpha So
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