BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. During
New Equipment | Cable & Wire Harness Equipment
For over 30 years ACDi has specialized in the manufacture of a wide variety of wiring harnesses, cable assemblies, and chassis units for commercial, industrial, military, and medical applications. ACDi is certified and listed by UL as a “Wiring Harne
New Equipment | Surface Finish
FlexTRAK plasma treatment systems offer high-throughput, strip-type, and inline boat processing for advanced semiconductor packaging applications. The FlexTRAK/FlexTRAK-S, FlexTRAK-CD/FlexTRAK-CDS, FlexTRAK-2MB, and FlexTRAK-SHS systems suit various
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New Equipment | Industrial Automation
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Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela
Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela
INNOVATIVE has integrated industrial robotic systems for applications that require 5 and 6 axis articulated robotic arms, 4 axis SCARA arms and 1,2,3 and 4 axis linear Cartesian robots. Advantages to a robotic system include shorter deliveries, quick
