Electronics Forum | Thu Feb 07 08:08:20 EST 2008 | scottp
We also use machinists dye. I like to pull a vacuum on the board after wicking the dye under the BGA. It seems to help fill fine cracks. I'll stick it in a warm oven if I'm in a hurry for the dye to dry. Then just bend the board to pop off the BGA.
Electronics Forum | Mon Mar 10 07:53:39 EDT 2008 | realchunks
Automatic on your screen printer is worth it. Having it off line or seperate machine is not, depending on your volume of product. If you have the time to pull product and measure each and every pad, then go for it. Feel sorry fot that operator whe
Electronics Forum | Mon Mar 17 11:09:36 EDT 2008 | swag
You might also try pulling the vision gantry and/or the camera cube off the machine, remove the air nozzles, clean them, and reinstall. They are easy to lose - be carefull. It's possible the air hockey "air pad" that these things are riding on is u
Electronics Forum | Tue Sep 02 12:49:07 EDT 2008 | markhoch
Out for reballing??? The LGA's that I'm familiar with do not have balls. Pull them off with a BGA rework station. Clean up the part and PCB by carefully removing extraneous solder, paste the PCB, (or the bottomside of the LGA itself) and replace. Ref
Electronics Forum | Mon Dec 22 12:14:15 EST 2008 | pcbbuilders
we sometimes have problems with solder paste release. we use a manual stencil printer. does anyone have any thoughts on using two passes of solder paste on the stencil? i have found that running the second pass gives me better deposits on the fine pi
Electronics Forum | Wed May 20 09:52:50 EDT 2009 | dwelch123
Use a push/pull tester. I use an OBA inst. works Ltd. tester. Just because mask comes off with bonder doesn't mean bonder is strong or cured right. Mask can be weak in between pads do to area size. Do it right and you'll know for sure. To many people
Electronics Forum | Fri Feb 18 12:00:08 EST 2011 | dennisfo
That has also been the standard here. We have a urethane line which pulls a vacuum on the mixture before transfering to the can. I plan on testing this out before receipt of the 73 thinner. I've also received some feedback with indication that the mi
Electronics Forum | Tue Sep 18 21:48:26 EDT 2012 | vergara1
Sorry. I don't see any solder balls. > > To me, it > looks like the solder wetted the pad and then > pulled back. It's called dewetting. It's a > defect. Ask your supplier for a SEM analysis. I'm > interested to know what he / she says. I see
Electronics Forum | Mon Jul 08 13:19:06 EDT 2013 | williamaxler
There are a lot of things that you need to look at to figure this out. What type of flux are you using? Is this leaded or lead free? Do you have the gradient of the nozzle setup properly? Are these locations tied to plains? With that being said
Electronics Forum | Fri Feb 07 19:30:52 EST 2014 | staylorebad
TM-650 specifies a 50mm (2in) length of tape to be used for the test. What about areas that are smaller than 50mm? For example component pads surrounded by open areas are much smaller than that as are vias. If they pull off using the tape test would
.gif)
