Electronics Forum | Thu Sep 17 08:23:03 EDT 1998 | Wayne Carlson
I need an evaluation process to prove to a customer that our no-clean process does not leave excessive residue? Any ideas?
Electronics Forum | Mon Sep 24 20:38:27 EDT 2001 | davef
Mike's comments are well taken. Your technique works fine with BGA, but uBGA are less forgiving. Again, let's take about: * Specifics of the problem. * Amount and method of applying flux. * What's holding the uBGA in-place before the solder ball an
Electronics Forum | Tue Sep 25 09:57:40 EDT 2001 | nwyatt
In regards to your last question, - problem is failures and most think it is due to too much flux - we apply flux with a brush - amount applied depends on the operator applying it - the flux is very thick and will hold the part in place before reflo
Electronics Forum | Fri Sep 28 16:51:41 EDT 2001 | pcmarch
I have had success by applying the paste flux with my finger, using a finger cot and spreading it on the PCB. This seems to put it on more consistently than using a brush.
Electronics Forum | Fri Apr 05 15:25:14 EST 2002 | davef
Spray fluxers: Where does the excess flux [that does not glomb on the board] go after being sprayed at the board? How do various spray fluxers [wave solder machines] route �used flux� differently?
Electronics Forum | Mon May 20 16:56:24 EDT 2002 | Gary
Excess slump of paste and mis-registration can cause solder balls along with moisture. Use same date code of pcb and run with no components, paste only. Also pre-bake boards with humidity sensor in oven. If high humidity, moisture and solvent residue
Electronics Forum | Wed Jun 26 12:24:38 EDT 2002 | dason_c
You can reference to J-STD-006 for your minimum requirement. There have a higher purity of the alloy and excess the standard but the price is higher.
Electronics Forum | Fri Jul 19 13:33:25 EDT 2002 | gdstanton
Dave, fyi...we decided not to go with the interconnects. At least during development phase due to excessive NRE to support the effort. However, we may revisit this when we come to production phase. Gregster
Electronics Forum | Mon Jul 29 18:51:47 EDT 2002 | davef
Consider: * Printing: errors [ie, insufficient, excess, skipping, etc.] paste doesn�t roll in front of squeegee, paste adheres to squeegee at the end of stroke, paste does not release. * Component placement: orientation, wrong component, missing comp
Electronics Forum | Fri Oct 25 04:06:56 EDT 2002 | kcngoi
Hi Adam, Excessive heat from soldering iron will left the burn mark of RMA flux. The residue is hard to remove. Suggest to use the Flux pen for better control.
