Industry News: fiducial mark alignment (Page 8 of 20)

Juki Automation Systems� Bob Black Appointed to IPC�s Global Board of Directors

Industry News | 2008-04-22 20:58:19.0

MORRISVILLE, NC - April 21, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that Bob Black Jr., its president and CEO, was appointed as an officer to the IPC�s board of directors.

Juki Automation Systems

Thermaltronics to Exhibit with Distributor (Adopt SMT) at SMT/Hybrid/Packaging 2018

Industry News | 2018-05-08 19:17:52.0

Thermaltronics have appointed Adopt SMT as the exclusive distributor of the new Thermaltronics Soldering Robot in Germany. They will exhibit the new Thermaltronics robot, TMT-R9800S, in Hall 4A, Booth 458 and 460, at the upcoming SMT/Hybrid/Packaging show scheduled to take place June 5-7, 2018 at the Messe in Nuremberg, Germany.

Thermaltronics USA, Inc.

Thermaltronics Launches New Solder Robot to Simplify Soldering Applications

Industry News | 2020-05-12 11:44:16.0

Thermaltronics USA, Inc. announces that it has added a new product to its solder robot range: the TMT-R8000S. The system simplifies and automates hand soldering processes with precision ball screws, servo motors and industry-leading software.

Thermaltronics USA, Inc.

Thermaltronics New Solder RobotSelected for 2020 GLOBAL Technology Award

Industry News | 2020-10-03 08:46:12.0

Thermaltronics USA, Inc. received a 2020 GLOBAL Technology Award in the category of Soldering Robots for its TMT-R8000S. The award was announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.

Thermaltronics USA, Inc.

Thermaltronics Receives Second Award for New Solder Robot

Industry News | 2020-10-27 12:37:44.0

Thermaltronics USA, Inc. received a 2020 Mexico Technology Award in the category of Soldering – Robotic for its TMT-R8000S. The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.

Thermaltronics USA, Inc.

FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009

Industry News | 2009-01-16 17:14:22.0

FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009

Finetech

ASYS Group unveils new Printer Platform and new technologies at IPC APEX

Industry News | 2014-02-14 22:45:00.0

ASYS Group is proud to announce the all new SERIO 4000 Printer Platform from EKRA, as well as the revolutionary PULSE Mobile Line Assistant interface for ASYS Handling and Process machines.

ASYS Group

Essemtec Introduces FLX2010C System with Vacuum Downholder for Flex Board Component Placement

Industry News | 2008-09-08 03:46:39.0

Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it has worked with leading suppliers of die bonders to develop a highly economical solution for the efficient placement of special components on film or flex boards, providing many benefits to the users.

ESSEMTEC AG

SEHO to Highlight SelectiveLine at IPC Electronics Midwest 2010

Industry News | 2010-09-02 10:50:13.0

SEHO Systems GmbH announces that it will highlight its SelectiveLine in booth 7719 at the upcoming IPC Electronics Midwest Conference & Exhibition, scheduled to take place September 28-30, 2010 at the Donald E. Stevens Convention Center in Rosemont, IL.

SEHO Systems GmbH

SEHO PowerSelective: New Software Feature Ensures Highest Process Reliability

Industry News | 2011-11-03 21:37:32.0

SEHO Systems introduces a new software function for its best-selling selective soldering system - the PowerSelective. The new function ensures even higher process reliability by compensating product or production-related warpage of the assemblies to be processed.

SEHO Systems GmbH


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