Industry News: filling vias with solder (Page 8 of 10)

Essemtec Wins NPI Award for Tarantula All Terrain Jet Dispenser

Industry News | 2018-02-28 08:22:00.0

Essemtec has been awarded a 2018 NPI Award in the category of Dispensing for its Tarantula – Relentless All Terrain Jet Dispenser. The system features state-of-the-art technology and can be easily integrated in any line. It is designed for a wide range of dispensing applications such as solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.

ESSEMTEC AG

World-class Dispensing in a Small Footprint

Industry News | 2020-06-11 06:23:00.0

Essemtec announces that its Spider smart-sized high-speed dispenser can be adapted for a wide range of dispensing applications including solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.

ESSEMTEC AG

Ventec Giga Solutions Appointed as Distributor for Sunus Printing Machines

Industry News | 2023-11-13 12:22:31.0

Ventec Giga Solutions, the equipment division of Ventec International Group announces its appointment by Sunus Precision Machinery as sales agent and distributor of Vacuum Filling Holes Solutions and Screen Printing Equipment. The agreement covers all regions globally outside of Asia.

Ventec International Group

YXLON International Wins Mexico Technology Award for FF70 CL 2D-3D X-ray

Industry News | 2019-10-26 15:09:16.0

YXLON International is pleased to announce that it has been awarded a prestigious Mexico Technology Award in the category of Inspection – X-ray for its YXLON FF70 CL Highest resolution advanced 2D and 3D X-ray system. The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

YXLON International

YXLON International’s FF70 CL 2D-3D X-ray Wins 2019 Global Technology Award

Industry News | 2019-11-13 11:53:45.0

YXLON International is pleased to announce that it has been awarded a 2019 Global Technology Award in the category of Inspection – X-ray for its YXLON FF70 CL highest resolution advanced 2D and 3D X-ray system. The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.

YXLON International

Essemtec to Show the Latest Dispensing and Jetting Valves at SMTA Guadalajara

Industry News | 2018-11-05 09:11:10.0

Essemtec announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place November 14-15, 2018. VP of sales for North America Steve Pollock will be onsite showing the latest dispensing and jetting valves and will be available for sales and technical discussions.

ESSEMTEC AG

Kester to Participate in Technical Conference at APEX 2009

Industry News | 2009-03-05 15:12:58.0

ITASCA, IL � March 2009 � Kester is proud to announce that Peter Biocca and David Scheiner will hold a technical session titled �PCB Metalization� at the upcoming APEX Conference and Exhibition. Biocca, Kester's Senior Market Development Engineer, will be the moderator at the conference, which is scheduled to take place on Wednesday, April 1, from 10:15�11:45 a.m. in the South Pacific room.

Kester

Innovative SEHO Solder Nozzles Reduce Process-Related Soldering Defects in Electronics Production

Industry News | 2010-10-14 16:20:31.0

SEHO Systems GmbH, a worldwide leading manufacturer of soldering systems, has expanded its range of innovative nozzle geometries for wave soldering machines, establishing a new level of quality in electronics production.

SEHO Systems GmbH

Balver Zinn to Demonstrate New Variant of Universally Regarded Lead-Free Solder SN100C™ at Productronica 2009

Industry News | 2009-12-07 17:57:03.0

BALVE, GERMANY — November 2009 — The BALVER ZINN Group, a leading provider of high-quality anodes with various alloy, as well as soft solders and special wires, announces it will demonstrate the brand new variant of their unique lead-free solder Balver Zinn SN100C™, in the form of SN100CS™ Solder in Hall A4, Stand 570 of the upcoming Productronica exhibition - scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.

Balver Zinn

Dow Electronic Materials to Showcase Leading Materials for Printed Circuit Board Manufacturing at the IPC APEX EXPO

Industry News | 2011-04-06 13:13:52.0

Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.

Dow Electronic Materials


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