Industry News | 2024-09-16 18:36:04.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the rising demand for ultra-thin electronic packages. As package thinness increases, issues like package warpage and its detrimental effects on production yield have become critical challenges. SHENMAO is addressing these concerns with its new Low-Temperature Solder (LTS) materials, which are engineered to lower reflow temperatures, mitigating PCB and substrate deformation while enhancing overall yield rates.
Industry News | 2017-10-17 19:59:54.0
CyberOptics® Corporation will demonstrate the SQ3000™-DD 3D Automated Optical Inspection (AOI) system with the new Ultra-High Resolution Multiple-Reflection Suppression (MRS) Sensors in Hall A4, Stand 239 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. The company also will unveil the new SE3000™ 3D SPI and SQ3000™ 3D CMM, both powered by MRS technology.
Industry News | 2018-03-16 08:13:49.0
As a leading solder materials innovator, Henkel recognizes the need for more holistic solder paste process analysis, especially as device miniaturization and finer particle size solders become mainstream. While many suppliers and manufacturers use proprietary solder material evaluation tools, there is a requirement for easily-implemented, standardized test vehicles that address the realities of today’s manufacturing complexities, particularly in the process areas of printing and reflow. The electronics business of Henkel Adhesive Technologies has developed such a tool.
Industry News | 2008-07-08 23:14:59.0
Bethlehem, PA - The results of a study conducted by the well-respected Fraunhofer Institute and commissioned by leading German electronics distributor, Ben Technologies, have confirmed that Ovation Products� HD Grid-Lok reconfigurable tooling technology is an extremely robust and cost-effective support solution for modern electronics production.
Industry News | 2009-07-14 10:06:07.0
DEK Solar has confirmed plans to showcase its latest breakthrough photovoltaic metallization solutions at the 24th European Photovoltaic Solar Energy Conference & Exhibition. Being held from September 21st – 25th in Hamburg, Germany, show highlights will include DEK’s recently launched PV3000 high throughput metallization platform, along with its pioneering print-on-print capabilities.
Industry News | 2009-12-10 01:05:59.0
Building on its successful lead-free solder products portfolio, Henkel has developed Multicore LF730, a Pb-free solder paste born from the company’s unyielding innovation commitment and arguably setting the benchmark for lead-free paste performance.
Industry News | 2010-03-15 12:51:59.0
DEK Solar will be bringing its newly-introduced PV3000 metallization line to this year’s AsiaSolar Energy Photovoltaic Exhibition and Forum, being held at Shanghai Mart from 30th March – 1st April. In addition to providing an opportunity for visitors to see the line in action, the exhibition will also enable attendees to find out more about the company's innovative approach to service and support.
Industry News | 2010-04-23 21:21:38.0
Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that effectively delivers on a broad range of demanding requirements, essentially offering a lead-free paste that has it all.
Industry News | 2010-05-05 20:50:16.0
HOUSTON - BPM Microsystems L.P., a leading supplier of device programming systems, today announced its support for the PowerXR family of high-performance programmable power controllers from Exar Corporation (Nasdaq: EXAR). Exar’s PowerXR ICs, combined with BPM Microsystems’ unrivaled universal device programmers, significantly reduce development time, cost and are easily reconfigured for real-time design changes.
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
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