Electronics Forum: forces (Page 8 of 116)

MPM AP25, separation problems

Electronics Forum | Thu Nov 03 01:20:35 EST 2005 | pavel_murtishev

Good morning, Thank you for assistance. I�m not so experienced with MPM maintenance. Explain me please what is the difference between �squeegee down force� and �squeegee pressure�? Squeegee pressure is set so 5-6 Kg. How can I check squeegee down fo

lead free and tombstoning

Electronics Forum | Fri Feb 17 11:01:47 EST 2006 | amol_kane

with lead-free solders, one would expect to find less instances of tombstoning. this is because SAC alloys are not eutectic and melt over a range of temp (usually 217-220 deg C) instead of at a single temperature. therefore the forces due to solder s

peel back force testing

Electronics Forum | Thu Mar 09 12:31:46 EST 2006 | jsloot

I am experiencing peel back problems when a particular component is used on a Meridian 1010 and 1020P machine. I would like to start testing this force but I need some more info. Besides GPD who else makes a tester? What industry standards can I refe

Flux Residues In Lead Free Wave Soldering Process

Electronics Forum | Sat May 27 12:50:14 EDT 2006 | GS

HI, just my 0,00001 cents Which preheat system does your wave solder has? for instance ? - IR ? - Bottom only ? - IR + Forced Air ? (bottom) - IR + Forced Air (bottom) IR top ? PCB thickness ? Appropriate preheat is important when looking to f

Assembl�on feeders

Electronics Forum | Sun Jun 25 08:51:02 EDT 2006 | cloggy

Problems like these are not caused by bad feeder quality. As described in the solution finding, the pull off forces of the cover tape are just too high. Cause is the blistertape and not the a feeder. Have you ever tested if the pull of force of the

IR zone vs forced convection

Electronics Forum | Mon Oct 30 09:24:21 EST 2006 | ronalds

I have some problems in sufficient preheating the pcb's. They splatter on the mainwave, causing solderballing. Less flux causes problems with the fill of the through- holes. We use a Delta Wave with 3 preheat zones, the first two are calrods the thi

BGA opens

Electronics Forum | Wed Jan 24 10:20:39 EST 2007 | electronhose

Seriously, OSP?, change the board finish, you are the OEM, correct? You have the power! Also, as another poster mentioned, high force applied at ICT ( possibily to cut through the OSP goop ?!? ) could be warping the board enough to crack the joints.

Peel Back Force

Electronics Forum | Wed Aug 25 11:52:36 EDT 2010 | fdr4prez

We've been breaking the cover tape on components from a specific supplier. I am curious what the standard is for the peel back force range, so I can better know if it is a feeder issue or component supplier. Of course the machine vendor is blaming

Pneumatic Feeders - how to control them

Electronics Forum | Tue Sep 27 15:58:01 EDT 2011 | ck_the_flip

We use exclusively pneumatic feeders and can NOT control the force or speed of advancement. We get a lot of components (mostly LED-type packages) that tend to flop around in the pocket a lot and are flipped on the side or “thrown” by the feeder duri

Mydata - Level too high in pick

Electronics Forum | Wed Sep 18 15:40:12 EDT 2013 | pankalaitz

Hello, we have problem with indicator. When we manually install a spring loaded tool into the Midas head, the force remain at 180. We can't use spring tools. Can you advise me how can we calibrate the force indicator and what else should I try to fix


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