Electronics Forum: fountain (Page 8 of 8)

Re: Air-Vac stuff

Electronics Forum | Thu Aug 19 23:56:49 EDT 1999 | Earl Moon

| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the

Re: Air-Vac stuff

Electronics Forum | Fri Aug 20 09:33:51 EDT 1999 | Don Morgenstern

Earl & Jeff Our machine is different than the Electrovert Solder Pak in that it is does not behave like a "volcano". Jeff, please contact me if you have safety concerns as perhaps you also want to consider our equipment. | | I'm trying a second ti

Question of delamination in PCB

Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef

From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff

Re: Micropax Connector Repair (Through Hole Version)

Electronics Forum | Sun Aug 15 11:02:37 EDT 1999 | Jeff Ferry

| Ladies and Gentlemen, | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous

Previous 3 4 5 6 7 8  

fountain searches for Companies, Equipment, Machines, Suppliers & Information