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Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Endicott Interconnect Technologies Credit/Source: Michael J. Rowlands, Rabindra Das More and more

BGA Package Component Reliability After Long-Term Storage

SMT Express, Volume 5, Issue No. 3 - from SMTnet.com

Economics, Technology Drive Industry To Non-Intrusive Board Test

SMTnet Express - November 27, 2019

Printed Circuit Board Failure Analysis

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