Electronics Forum | Mon May 20 16:15:48 EDT 2019 | davef
Resources are: * IPC-7525A - Stencil Design Guidelines, 3.5.2 Step-Up Stencil This type stencil is useful when it is desirable to print thicker solder paste in a small portion of the stencil. An example would be a ceramic BGA where it is necessary t
Electronics Forum | Tue Apr 03 13:27:58 EDT 2001 | mparker
go to http:\www.ipc.org. get the following standards: IPC-A-600F Also look at the IPC-6010 series, this may help with your design group. Finally, consider getting IPC-SM-782 and IPC-7525. These are for Surface Mount Design & Land Pattern Standards
Electronics Forum | Wed Nov 25 01:00:54 EST 2009 | henry_usa_stencils
The design of the opening apertures for the glue stencil and the metal thickness.Its is very important. The Engineer of the stencils supplier have to look into the height of the components and the gap of the 2 leg(pads)and give the assemly house an s
Electronics Forum | Fri Feb 16 10:25:31 EST 2018 | ameenullakhan
Hi Rob, Thanks. We have very high mix low volume products. Even our stencil suppliers have problem to fix. So we are landing up getting one more stencil after checking the issue in NPI build. we are trying to add up all and have guideline. which i
Electronics Forum | Mon Oct 09 19:56:41 EDT 2000 | Dave F
CJ: Arturo and the others make good suggestions. Consider: IPC-7525 Stencil Design Guidelines
Electronics Forum | Tue Jan 16 21:00:11 EST 2001 | davef
Two good sources of information are: 1 IPC-7525 Stencil Design Guidelines 2 SMTnet fine Archives [once the guys get them back up and running after the conversion is complete]
Electronics Forum | Mon Dec 16 13:33:09 EST 2002 | pjc
square apertures provide better paste release than round in most applications. See IPC 7525 Stencil Design Guidelines
Electronics Forum | Sun Apr 01 09:26:13 EDT 2007 | mika
Thanks DaveF, I think the IPC-7525 - Stencil Design Guidelines (which is overall a pretty good guideline) does not perfectly apply in this case. I would rather go for a little bit over print, as for a CCGA; unless I misinterpreted the info. I really
Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW
| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)
Electronics Forum | Tue Dec 21 18:09:24 EST 1999 | Brian W.
I have been soldering 0603 components on the bottom side using a glue and wave solder process for a long time. Bridging has not been a common problem. However, it is inherent on the design engineers to follow good manufacturability planning when la
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