Electronics Forum | Wed Aug 06 20:50:42 EDT 2003 | davef
Well, if it "keeps coming up", let's take a pass at keeping down. For: * Requirement that gold be removed from components, pads, etc. is J-STD-001C, 5.4.1 * Context of that requirement [J-STD-001C, 5.4.1] and 6 or 7 references are in IPC-HDBK-001.
Electronics Forum | Fri Jul 16 22:44:27 EDT 1999 | Vic Lau
| We are currently assemblying several different board type with gold plated lands with varying results. Can any of you that has successful experience in this area give me some pointers. What paste do you use? Do you use the recommended reflow pro
Electronics Forum | Tue May 13 06:57:10 EDT 2003 | davef
Your vendor site is totally correct. 2Ag is an excellent solder, but it does nothing to prevent tin and gold from reacting chemically. An earlier poster is correct gold goes into solution in liquid solder very fast, less than a second. Gold and ti
Electronics Forum | Thu Jul 15 18:58:48 EDT 1999 | Earl Moon
| We are currently assemblying several different board type with gold plated lands with varying results. Can any of you that has successful experience in this area give me some pointers. What paste do you use? Do you use the recommended reflow pro
Electronics Forum | Mon Jun 12 07:42:56 EDT 2006 | brian.perry@suntroncorp.com
We are placing a gold plated device (LCC) to a NiAu PCB using a SnPb No-clean solder. We're noticing quite a bit of difficulty with reliable joints (intermittent connectivity) and if we have to rework a particular device, adjacent devices of this sa
Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Thu Nov 10 12:29:57 EST 2022 | stephendo
The G in ENIG is gold. It does not oxidise. Either you are thinking of OSP or your board shop is providing defective boards if your boards show oxidation. It would be the nickel that is oxidising but should be totally covered by the gold. Is there
Electronics Forum | Thu Nov 10 20:39:44 EST 2022 | SMTA-64386598
The solderability shelf life of ENIG is related almost entirely to diffusion of O2 through the gold plating. When O2 diffuses through the gold, the underlying nickel is oxidized rendering it unsolderable (with ENIG - you solder to Ni, the gold dissol
Electronics Forum | Mon Feb 09 16:55:28 EST 2009 | cuperpeter
Hi Sachin, thanks for your feedback. According to our supplier, surface plating is electrolytic gold over Nickel(not ENIG), but I think that is a still improper thickness for Au. (according to 3rd Working Draft from September 2008 of IPC 2221B "0.4
Electronics Forum | Tue Mar 31 05:26:14 EDT 2009 | d0min0
Hello, we had similar problem in the past - when we had to change PCB supplier from a batch of hundreds of boards (NiAu plated, SnPb process) we got 2-3 boards with paste wicking to components leads what we did, was to check the thickness of gold on
