Electronics Forum: gold leads (Page 8 of 39)

PCB Au thickness

Electronics Forum | Tue Oct 07 08:38:05 EDT 2003 | davef

J-STD-001C requires removal of gold from (through-hole) component leads when the thickness of the gold layer is above 2.5 microns to prevent problems with embrittlement. The thickness of gold on an ENIG board typically is around 0.05 micron, resultin

Re: Soldering to Gold

Electronics Forum | Thu Sep 16 20:55:35 EDT 1999 | Dave F

| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re

Solder Balls

Electronics Forum | Wed Aug 12 00:16:43 EDT 1998 | Ron Costa

Hello everyone, I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible solde

lead substrate materials

Electronics Forum | Tue Jan 29 09:19:56 EST 2002 | bob_smith

Can someone tell me what metal substrates are comonly used for component leads with gold plating? If the gold plating is missing, are any of the substates incompatible with 63/37 solder? Thanks.

Gold Leaded SMT devices

Electronics Forum | Tue Sep 09 20:32:10 EDT 2003 | davef

The maximum ratio of gold weight to solder alloy weight can be calculated, to help prevent a problem from excessive gold-tin intermetallic compound (i.e., AuSn4). For the equation and its derivation, please refer to "The Use of Capillary Action Measu

facing cold joint problem

Electronics Forum | Sun Jan 18 10:13:59 EST 2004 | davef

Materials added to solder can change its appearance. For instance: * Gold in tin/lead solder is dull / grainy * Palladium in tin/lead solder is dull / grainy We do NOT advocate using visual appearance to define the appearance of a good and a bad so

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 06:01:12 EDT 1999 | Earl Moon

| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a

Re: Surface Mount Connector Strength

Electronics Forum | Thu Jan 14 23:38:34 EST 1999 | Chris G.

| I am experiencing a problem with a surface mount coax connector that over time pulls loose from the PWB. The connector has 4 small gold plated leads and we are soldering it to a flash gold board. A cable plugs into the connector and puts some con


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