Electronics Forum | Mon Feb 14 02:59:03 EST 2000 | Joe
check the solderablity of the board and the thickness of the solder before screening, if you are using HASL finished boards.
Electronics Forum | Fri Dec 13 09:06:30 EST 2002 | russ
One thing I have found when using square or diamond etc... Fiducials is, if it is a HASL finish board, the finish may be thick and the fid camera will see them having rounded edges different sizes etc.. and will cause quality failures. Russ (My sp
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure
Electronics Forum | Tue May 09 22:57:58 EDT 2006 | davef
The NexLev connector is built in a stripline construction, providing a continuous ground plane for each signal contact. The connectors come as tenrow connectors with 100, 200, or 300 positions at possible stacking heights from 10 mm to 30 mm. Technic
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Fri Sep 10 15:32:30 EDT 1999 | Earl Moon
| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with
Electronics Forum | Wed Dec 15 15:55:05 EST 1999 | Mike Naddra
As a general guidline I would agree with a 10% aperature reduction on chip caps , resistors, and fine pitch provided correct land geometries. When soldering to HASL surface finishes. Three things you may want to consider ; the stencil thickness, the
Electronics Forum | Mon Mar 16 01:06:25 EST 1998 | Victor Ng
Dear all, Recently I have a problem of non-wetting at our wave soldering process. It appears only on the SMT pads for the chip components (at the solder side) of the HASL PCB. With all the same parameters on the wave soldering machine, i
Electronics Forum | Thu Jan 06 06:15:49 EST 2005 | mattkehoe
We need some opinions about a situation that is causing problems in our process. The pcb's in question are .125 thick with a HASL finish. The boards are coming in with a large amount of solder trapped inside the via holes. Sometimes this solder is ac
Electronics Forum | Tue Apr 27 12:14:08 EDT 1999 | M Cox
Board Experts I am fighting with a board house about a delamination problem.. First the facts 1) 10 layer board .063 thick HASL Finish Aprox 16 in x 17 in. 2) 150 Boards with this part number built with the same reflow oven settings (212 c max t
