Electronics Forum: improve print (Page 8 of 24)

Stencil aperture positional accuracy

Electronics Forum | Fri Jul 06 04:55:59 EDT 2012 | ccgooi

I have fabricated a artwork of stencil on a mylar and make comparison on PCB and Stencil in order to confirm if there is any PCB stretching at both end. The results are comparable for both stencil and PCB without any stretching . So,I assumed that th

stencil/printing machines for solder paste

Electronics Forum | Wed Feb 25 21:47:24 EST 2015 | dinhhuunam

Hi Marshall Bartel, SJ INNOTECH Printer is Best solution & Service for you ! HP-520S/HP-620S/HP-760S/HP-1000S Printing (±0.0125mm) Repeatability (±0.01mm) 0.3 Pitch QFP, 0402 Chip, Ø0.2 MBGA Speed/pressure control by printing section (5 sections) V

Re: Laminate base material

Electronics Forum | Mon Mar 27 20:52:22 EST 2000 | Dave F

Marc: In printed circuit board fabrication, fabricators place sheets of prepreg between each pair of glass cores. They stack these layers into books. As they heat and press the books, the sheet melts into an epoxy glue. The thickness of the prepr

Solder Paste Printed Volume

Electronics Forum | Tue Dec 11 13:56:38 EST 2001 | Damian Holzmann

Regarding your comment "technology doesn't seem to have improved". Actually, technology has improved significanty. Cyber Optics uses a line measurement, a new unit from Germany uses sine wave differential measurement. The Gridmeter unit captures a vi

Yield on 0402 SMT Printed Circuit Board Assemblies

Electronics Forum | Thu Jan 04 20:31:21 EST 2007 | Ben_T

Have you thought about an AOI system? With the system we have where I work, I'm able to run queries that'll tell me DPMO, yield, and pass/fail rates on a board level, part level, and opportunity level. Furthermore, this data can be broken down to see

Larger lands in corners

Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef

Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad

Re: Process Control (Stencil Printer)

Electronics Forum | Tue Jan 12 14:59:14 EST 1999 | Earl Moon

| What would be a good metric for process control of a stencil printer? (fully automatic, vision equipped, stendil printer). | I'm doing some more DEK 265 GSX's with everything imaginable hung on them. Have done Lt's and the MPM2000. This makes mach

Adhesive Application by Stencil

Electronics Forum | Fri Mar 23 14:13:20 EST 2001 | mnaddra

RW, I have Screened Adhesive on to several different assemblies and have found that when it is possible I get a much better result than with a dot deposition process (The green strength was greatly improved), the biggest issue I ran in to was the pr

Re: PCB thickness

Electronics Forum | Wed May 17 20:37:08 EDT 2000 | Steve

At our facility, we process FR-4 boards for PCMCIA cards (0.020"). The key for us is dedicated fixturing for stencil printing and fixturing for reflow soldering. We are working closely with our customer to better improve panel design, but other than

Re: acceptable defect rates for smt process, in ppm.

Electronics Forum | Sat Jan 15 13:13:33 EST 2000 | Mark Wiegold

Steve, Basically in answer to your question, there is no real set number for defects. Defect rates will vary between products and companies. If my company was running the same product as yourself then there is no reason to suggest that the defect ra


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