Electronics Forum: indian and manufacturers (Page 8 of 39)

Time and temp in lead and lead-free reflow

Electronics Forum | Tue Jul 29 10:46:17 EDT 2008 | realchunks

Oh, well if you can profile, model your profile to the profile supplied by the paste manufacturer. Anything outside of their recommended profile is all experimantal.

Time and temp in lead and lead-free reflow

Electronics Forum | Fri Jul 25 23:01:04 EDT 2008 | chip_flip

What paste are using? You should referance the manufactures time and temperature specification. Running lead-free in a 5 zone oven can be done with out a problem but it is not production friendly. If you are concerned with through put I would look fo

Time and temp in lead and lead-free reflow

Electronics Forum | Fri Aug 01 21:10:35 EDT 2008 | leo_dektec

You can keep only the 5th zone as the reflow zone. And lower the first two zones to keep a good ramping rate. Meanwhile,please note the ting temperature in software or control panel is not the exact temperature in your PCB, you'd better get a KIC or

Solder Paste Storage and Control

Electronics Forum | Thu Oct 30 11:34:51 EDT 2008 | davem

Guys, So I recently started working for a small CM in Southern N.H. We currently use 2 Magic Chef Mini wine friges to store the solder paste (63/37, RoHS). I've been monitoring the room temp (and humidity) and the frige temps all this week. The pro

Bow and Twist of PCB's

Electronics Forum | Wed Aug 19 05:00:56 EDT 1998 | Tom Blum

Hi there, I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In order to

BGA and QFP orientation in trays for pick and place

Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith

BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou

CIM systems and Final Assembly

Electronics Forum | Mon Jan 22 15:01:32 EST 2001 | aiscorp

CIM systems for electronics assembly have traditionally considered the PCB only. Final assembly "modules" are often attached to traditional systems to accommodate this common requirement for pre-PCB assembly, mechanical assembly, and final assembly

Re: Package outlines and footprints

Electronics Forum | Sat Jun 12 16:24:02 EDT 1999 | JohnW

| Is there public domain information available on standard surface mount package outlines and footprints? | Thanks, | WillyW | Willy, The IPC has a great listing for the std packages and footprints, as do most component manufacturers. I'd start on

Tray Parts and Velcro Straps

Electronics Forum | Thu Nov 07 11:21:43 EST 2002 | Edward

Uh, Great Idea..... There is and has been ESD safe carpet for years. We have it in our manufacturing area right now.

BGA's, 0402's and HASL Boards

Electronics Forum | Wed Dec 22 08:49:55 EST 2004 | markhoch

I'm looking for some data to support my argument that HASL boards are not the most ideal boards for manufacturing involving BGA's and 0402's. I'm sure one of you SMT Gurus out there can point me in the right direction! Thank you in advance!


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