Electronics Forum | Fri Jan 08 13:22:11 EST 1999 | Earl Moon
| This is a question for those of you who actually assemble components onto a board. | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall qua
Electronics Forum | Fri Jan 08 21:46:49 EST 1999 | Dean
| | This is a question for those of you who actually assemble components onto a board. | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall
Electronics Forum | Wed Mar 03 12:01:08 EST 1999 | Dave F
| I'm trying to get a feel for what the industry is doing with regards to collecting assembly defect data in the SMT/PWA process. Is it sampling or 100%? What are the points within the process where critical assembly defect data is collected. We run
Electronics Forum | Sun May 02 18:44:26 EDT 1999 | JohnW
| | How's the "Great Gas-out" going for ya'll? | | | | Myself, I'm doing real good! Haven't farted all day...(GRIN) | | | | Anyways, a thread got started down below about this so-called "Lead Free" stuff, and I just wanna' put my two cents in about
Electronics Forum | Wed Oct 28 19:45:33 EST 1998 | Ron Gilman
I will try to answer some of your questions. My name is Ron Gilman and I am President of Chipscale Robotics here in Fremont California. We manufacture Die Pick & Place equipment and would be happy to send you brochures. Please email me with your a
Electronics Forum | Fri Aug 03 17:00:57 EDT 2001 | mparker
Start with a definition of what you expect the AOI to achieve at each station. Will your in-line machine be post print? Place (pre-reflow) or post reflow? Rather than buy one very expensive machine to put at the end of the line, maybe a couple of
Electronics Forum | Sat Jan 09 12:31:42 EST 1999 | Steve Joy
| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp
Electronics Forum | Thu Mar 04 18:18:02 EST 2004 | Ken
There is a japanese company that makes a ultrasonic hand-held stencil cleaner. I demo'd it for a day and it was fantastic! It even cleaned epoxy stencils. Can't recall the price...but it should be much much less than the smart sonic and other "mac
Electronics Forum | Tue May 11 12:02:03 EDT 1999 | Tony
| We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | All other tips are also welcome. | | Thanks | Philip, I have been doing BGA rework for
Electronics Forum | Thu Oct 15 14:35:44 EDT 1998 | Joseph Belmonte
Hi Folks, As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process? Are
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