Electronics Forum | Tue Apr 09 15:24:29 EDT 2002 | Alan W.
I have recently signed onto a company with very little board assembly experience. I am trying to develop a process control and continuous process improvement program for a new surface mount line, but have run into several people who are not really i
Electronics Forum | Mon Apr 15 18:55:25 EDT 2002 | davef
Use the same size samples all the time, eh?
Electronics Forum | Wed Apr 10 10:32:39 EDT 2002 | slthomas
Ask your compadres how you can control a process when it's output has already been completed? If you do second side assembly before you inspect the first side, you can't possibly apply real time corrective action. I know what I'm talking about in t
Electronics Forum | Wed Apr 27 11:43:32 EDT 2005 | patrickbruneel
Hi Daan, What we did in the time was pareto analyses on all board designs to determine the critical areas (mainly design errors) and only inspect those specific problem areas. Every batch had a copy of the PC board with problem areas marked and only
Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Electronics Forum | Fri Apr 02 10:26:13 EDT 2010 | fishingfool
Manjunath The top camera will be used for probably 90-95% of your inspection needs. However, without side cameras that 5-10% of uninspected parts can be a real pain to manually verify. What you need to figure out is what is your product to inspe
Electronics Forum | Fri Apr 12 15:48:33 EDT 2002 | jersbo
SPC for each assembly(I use C(for board defects)NP(for unit defects) at the end of reflow to determine process capabilities determine Control limits. Once control limits are set, inspectors stop the process until out of control limit is addressed and
Electronics Forum | Tue Apr 09 21:40:26 EDT 2002 | ianchan
We are a local enterprise with limited resources, just like you described, so hope this experience sharing helps : we place a production Visual Mechanical Inspection (VMI) inspector at the end of each Reflow Oven area, complete with magnify scope 30
Electronics Forum | Thu Jun 19 13:39:47 EDT 2003 | Steve
So how much clearance between components (in mm) does the Ersascope require? What if you have caps around (2-3mm from the BGA's edge) a BGA . . . is it necessary to remove them prior to inspection of the BGA?
Electronics Forum | Sat Aug 15 06:59:01 EDT 2020 | toki
Hello everyone, hope everyone is doing well. I would like to know what should i look for while purchasing an X-Ray machine for SMT production line. I am looking for offline x-ray machine and budget below 90k usd. It will be used to inspect BGA, QFN a
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