Electronics Forum | Mon Dec 04 11:46:41 EST 2006 | samir
SMTNetters, I have a product coming down the pipeline that we'd like to make pure double sided reflow, it'll be RoHS product, and the hope is... we'll be able to solder the thru-hole stuff by screen printing solder paste and reflow soldering. Anybo
Electronics Forum | Wed Aug 02 21:36:22 EDT 2006 | Lawrence
Anyone use these for soldering through-hole components? Our comapny is contemplating several options such as preforms,capital equipment like spot soldering equipment and the intrusive reflow system. We are in the process of deciding which strategy we
Electronics Forum | Wed Nov 20 03:52:16 EST 2002 | iman
Hello, need help on intrusive reflow process, thanks in advance to the experts and general info sharing :) need some help to obtain answers, to following questions: 1) PCB is FR4, 1.6mm thick, 4 layers, what stencil thickness (stencil design guide
Electronics Forum | Mon Dec 04 14:27:18 EST 2006 | pjc
Solder preforms can be used in SMT assembly for through-hole pin-in-paste process. In this process and modified aperture is used to print the paste with standard stencil printing, then a solder preform is picked and placed by a machine into the solde
Electronics Forum | Mon Dec 04 12:32:45 EST 2006 | russ
Made no changes to pip process for lead free. Everything stayed the same. just have to ensure that components can withstand the high reflow temp. incomplete hole fill is from aperture not being big enough. Many people forget that paste reduces in
Electronics Forum | Wed Dec 06 16:27:35 EST 2006 | mscalzo3
We would be able to help you in any way that we can. There was an article in SMT magazine that explains a lot. Also, we have data on other processes that have successfully done this conversion. This has been a popular way of eliminating the conver
Electronics Forum | Fri Dec 15 03:16:11 EST 2006 | pavel_murtishev
Good morning, The critical points for successful PIP technology are: 1. Gap between THT lead and PHT hole. It shouldn�t be greater that 0.2mm; 2. Lead shape. THT leads MUST be straight or you�ll get excessive voiding otherwise; 3. As Russ said, pas
Electronics Forum | Mon Mar 26 08:52:19 EDT 2007 | realchunks
Hi J, Yes, we do too. Funny thing is I was just looking at this last Friday. We call it sharing the bottom of the barrel. Typically it's just Process Engineers stuck down here, but from time to time, Maintenance gets stuck down here too. When in
Electronics Forum | Tue Dec 04 14:31:50 EST 2007 | davef
Search the fine SMTnet Archives for previous discussion. This technique has been called 'pin-in-paste,' 'paste-in-hole,' 'intrusive reflow,' 'alternative assembly and reflow technology' and who can remember all the other consultant buzz-words. Look a
Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis
Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just
