Electronics Forum | Tue Aug 22 15:24:08 EDT 2023 | grayumm
Evtimov, here is a picture of what we are seeing. After evaluating with the IPC-A-610 book it looks like we are getting an insufficient Heel Fillet Height. I will add a picture of an example. UPDATE: i cannot figure out how to add a picture to this m
Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Thu May 01 12:28:56 EDT 2008 | petergog
what is the main concern about this reqirement? Why IPC-A-610c is revsised to this? IPC-A-610c said it is a defect.Solder touches the body of a plastic bodied component, eg SOICs and SOTs. But D version think it is acceptable. WHY? I thought "plasti
Electronics Forum | Thu Aug 07 22:51:05 EDT 2008 | davef
We expect aerospace to be IPC-A-610, Class 3 and J-STD-001, Class 3. The above quality statement stecifies: * "IPC 610, Class 2 acceptability." This is unclear. Should this be "IPC-A-610, Class 2 acceptability?" * No class for J-STD-001. Should we a
Electronics Forum | Wed May 27 13:50:38 EDT 2015 | ingallsd
I saw a question regarding the acceptability of stacking chip components at this forum posted in 2000. Unfortunately no one could cite any applicable IPC sections at that time. I am now able to find that this is acceptable per IPC-A-610D, Section 8.
Electronics Forum | Sat May 27 08:58:07 EDT 2000 | Thanas
Hi, I'm new in SMT & confusing to define the soldering defect criteria of cold solder, dry joint & dewetting. & what's the root cause for them ? FYI, I had read the IPC-A-610 rev. B , but doesn't help much. Any advise is very much appreciate. Thanks
Electronics Forum | Thu May 31 10:40:30 EDT 2001 | davef
See, all those bad thoughts we had ... The guilt, how do we live with it? 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IPC-4101 IPC-A-600 3c PCB assembly: J-STD-001 IPC-A-6
Electronics Forum | Mon Jun 11 10:41:16 EDT 2001 | techment
Can someone helps to interpret the IPC-A-610's requirement on solder balls ( less than 5 mils in diameters.). We found about 6 to 10 balls ( less than 5 mils ) scattered in a 600 sq mm board. Is it consider failing for class 2 product ?. Thank you.
Electronics Forum | Wed Jun 13 21:30:23 EDT 2001 | davef
We use a great concensus document for inspection. It is: IPC-A-610C, Acceptability Of Electronic Assemblies as the basis for accepting assemblies. You can find it at IPC [http://www.ipc.org]. [Help!!!! I�m turning into an IPC Cal.] We find that m
Electronics Forum | Fri Jun 29 14:13:05 EDT 2001 | markhoch
Just a quick thought on solder balls "or beads" caused when using NC paste. I found a spec (12.4.10 in IPC-A-610C) that says solder beads are acceptable if they are entrapped in NC flux residue and can not be dislodged in the normal service environme
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