Electronics Forum: j std (Page 8 of 61)

Re: Immersion White Tin

Electronics Forum | Tue Mar 07 17:04:13 EST 2000 | K. Ckak

Hi Steve, I think MIL-P-81728A, MIL-F-14256 and Fed std QQ-S-571/624 talks about it, but it has been superseded by J-STD-006. Hope it helps. Regards Kc.

Re: Reflow Oven

Electronics Forum | Tue Jun 13 22:42:36 EDT 2000 | Dave F

Jeff: Last place I can recall seeing something like that is NASA-STD-8739.3 Requirements like this are not currently in vogue. A modern solder process should conform to J-STD-001, which makes no mention of prebaking boards.

Re: Immersion White Tin

Electronics Forum | Tue Mar 07 17:04:13 EST 2000 | K. Ckak

Hi Steve, I think MIL-P-81728A, MIL-F-14256 and Fed std QQ-S-571/624 talks about it, but it has been superseded by J-STD-006. Hope it helps. Regards Kc.

What standards should electronic manufacturing meet?

Electronics Forum | Tue Mar 09 13:31:59 EST 2004 | blu_nozer

I suggest you look at the IPC/EIA J-STD-001C. It provides 3 different yardsticks depending on the end use of the equipment. Class 3 became the de facto military standard in Noth America since MIL-STD-2000A was withdrawn. Bob

Key Points to be considered while buying Ionic Contamination Tester

Electronics Forum | Mon Nov 02 22:04:30 EST 2015 | davef

An ionic contamination tester should meet industrial cleanliness specifications including MIL-STD-2000A, MIL-P-28809, J-STD-001 and Resistivity of Solvent Extract (ROSE) Test Method IPC-TM-650 2.3.25

High-Temperature Solder Paste/wire: Sn05Pb93Ag02B

Electronics Forum | Tue May 28 17:50:20 EDT 2002 | myu

Hi, Everybody! I'm looking for a High-Temperature Solder Paste / wire: "Pb93WROL140.71454";or "00Z890"; J-STD-006 Solder Alloys Sn05Pb93Ag02B Sn% Pb% Ag% Solid C Liq C Solid F Liq F 5.0 92.5 2.5 280 284 536 543 It should meet IPC/J-ST

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.

unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-

SMT gold plated components

Electronics Forum | Wed Aug 06 20:50:42 EDT 2003 | davef

Well, if it "keeps coming up", let's take a pass at keeping down. For: * Requirement that gold be removed from components, pads, etc. is J-STD-001C, 5.4.1 * Context of that requirement [J-STD-001C, 5.4.1] and 6 or 7 references are in IPC-HDBK-001.

BGA & QFP post reflow inspection

Electronics Forum | Wed May 04 04:31:44 EDT 2005 | siverts

What is the MS-level and floor life of the critical components (should be written on the MSD-bag)? What is Your climate condition in the production area (%RH, temp.)? Are you doing this inspection on every board or is it enough to do it on the first

Questions on J-STD-033A procedure (Table 4-1)

Electronics Forum | Wed Feb 15 19:27:24 EST 2006 | CW

Reviewing the J-STD-033A procedure and try to better understand Table 4-1 ... There are 3 columns for Baking Temperature & recommended Duration ... 1st one is for 125C, then for 90C, then followed by 40C ... it also specify the environmental condi


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