Electronics Forum | Sat Feb 18 09:20:09 EST 2012 | davef
The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedize
Electronics Forum | Thu Feb 17 09:52:48 EST 2000 | Alberto
Hi, Does anyone knows if there are any standards about passive smd components codification? Or each component manufacturer creates is own conding? Do they follow any rules? Thanks, Alberto
Electronics Forum | Thu Feb 17 09:52:48 EST 2000 | Alberto
Hi, Does anyone knows if there are any standards about passive smd components codification? Or each component manufacturer creates is own conding? Do they follow any rules? Thanks, Alberto
Electronics Forum | Tue Nov 26 13:56:09 EST 2013 | aaronpavone
If I wanted to verify my process to ensure that it is not exceeding maximum lead temperature for the determined time on a component data sheet while soldering, where should i measure from? I am currently measuring from the tip of the lead on the seco
Electronics Forum | Tue Oct 09 05:38:29 EDT 2018 | dfl
Hi, my Quad IV-c is showing a really dark image on the camera and its VERY difficult to see the components pads to make the adjusts. I already check the monitor brightness (at maximum and I can see the crosshair, so the monitor is good) and already
Electronics Forum | Sun Dec 08 09:59:39 EST 2013 | davef
Component fabricator is concerned about the temperature of the lead at the point where the lead enters the component body. So, if you sink temperature at that point, you will assure a lower chance of damaging the component.
Electronics Forum | Tue Sep 12 19:36:17 EDT 2006 | davef
We've been soldering leadfree components for maybe 15 years. We'd be surprised not to be able to store components for at least a year, not that we purposely do that. Component fabricator process determine the maximum storage time for components. M
Electronics Forum | Thu Mar 20 03:40:13 EST 2003 | 9khonnei
some one can help me? I will need Picture of SMD component shape & Diamension for make trainning doccument.If has many kind of component is better for me. Thanks
Electronics Forum | Tue Jun 08 10:01:34 EDT 1999 | John Thorup
| Can anyone please help me locate details on maximum allowable temperatures of components when passing through a reflow oven. | | I think I want the thermal profile for the part, or a source or standard which will allow me to check if I can safely
Electronics Forum | Sat Nov 18 21:20:58 EST 2006 | Fer
Dave, May I ask where did you find the 1.5%, or the goal of .005" (or .007") per inch? The IPC-A-600 bow and twist standard calls for a .75% based on the calculation of the test method TM-650, method 2.4.22, which calculates the percentage based on
