Electronics Forum | Thu Jul 05 07:34:57 EDT 2001 | steven
what is the main reasons that casuing solder ball during reflow? and how to remove them? (mostly arround the connector leads or between the 2 0402 chips). solder paste is RMA type. need advise. thanks
Electronics Forum | Wed Jan 26 00:53:40 EST 2005 | Adam
Are there any methods for mounting ball grid arrays without a reflow oven? More and more chips are coming in the format and as a student I am not interested in production line quantities.
Electronics Forum | Thu Nov 01 22:32:57 EDT 2007 | lvzhu
CSP has pillow, the BGA's ball doesn't combination with the solder paste. also ,the 0402 chip aftet the oven ,the surface looks like many tin ball pile together. how solve this problem. thanks for your discuss.
Electronics Forum | Thu Feb 22 00:22:53 EST 2007 | J. Pigott
I realize this is a bit off topic but looking at some of the discussion. I expect someone might be able to help. Looking at CP IV ball screws 120" and searched the world over for specs. Lead Outer Diameter TPI backlash resolution typical wear on c
Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker
Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a
Electronics Forum | Sun Jun 12 08:37:20 EDT 2005 | davef
Paramjeet Singh Gill Flip chip with aqueous flux, that's interesting. * What is the stand-off from the board is your flip chip? * What machinery and materials do you use clean your boards? * How do determine the cleanliness of the board under the fl
Electronics Forum | Mon Sep 12 12:22:10 EDT 2005 | Rob
Then he's a very naughty man! Advantis with Lightning head: Chip Accuracy +/- 68uM @ 3 sigma CP643: +/- 66uM @ 3 sigma CP842: +/- 55uM @ 3 sigma I know specs are just statistics but both our Fujis & Universals still calibrated to well within the m
Electronics Forum | Sat May 06 06:19:36 EDT 2017 | rob
You could also try some of the 3D MID placement machines - some have dispense heads in with the placement heads, so theoretically you could place on the PCB paste, dispense on the terminals. and place the new part. Yamaha/I-Pulse do a couple: https:
Electronics Forum | Fri May 19 09:53:40 EDT 2017 | deanm
We machine place the first part, then add two dots of dispensable solder paste to the top of the terminations, then hand place the second part on top of the first. Reflow. It works better than hand soldering after reflow. The solder paste is dispens
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
