Industry News: mid chip balling (Page 8 of 34)

Saline Lectronics Announces New In-house Wire Bonding Capability

Industry News | 2015-08-11 09:37:25.0

Saline Lectronics now offers wire bonding in-house as an added-value service. With the installation of the Kulicke & Soffa 4500 Manual Wedge Bonder, Saline Lectronics is now one of the only electronic contract manufacturers in the Midwest to support wire bonding services. 

Saline Lectronics, Inc

WORLD'S FIRST SUPER FAST LOW TEMPERATURE UNDERFILL

Industry News | 2014-06-30 14:25:43.0

YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88 series. SMT 88 is a series of new underfill products that enable a faster cure while being held at room temperature.

YINCAE Advanced Materials, LLC.

SMT 88UH Fast Cure, Reworkable Underfill

Industry News | 2014-07-08 11:04:03.0

YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88UH. SMT 88UH is a new and groundbreaking underfill. It can be underfilled at room temperature without preheating a substrate.

YINCAE Advanced Materials, LLC.

YINCAE’S New Highly Conductive Thermal Underfill: SMT 158D

Industry News | 2018-05-14 10:30:22.0

The world's first commercial diamond filled underfill.

YINCAE Advanced Materials, LLC.

YINCAE’s New Underfill with Zero Outgassing: SMT 158HA

Industry News | 2018-09-04 15:51:06.0

YINCAE is excited to announce that we have developed SMT 158HA, an underfill with zero outgassing that is fully compatible with flux material.

YINCAE Advanced Materials, LLC.

Test Strategies for High Density Packages Course Presented at EtroniX 2001

Industry News | 2001-02-01 09:07:37.0

Yervant Zorian, Chief Technology Advisor of LogicVision Inc., will present a course entitled, "Test Strategies for High Density Packages" in the EvaluTech Conference at EtroniX 2001.

Reed Exhibitions

Metcal to Bring New Rework Tools to the IPC APEX EXPO

Industry News | 2015-01-20 18:02:54.0

Metcal today announced plans to exhibit in Booth #627 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be displayed for the first time, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.

Metcal

Metcal to Introduce New Rework Tools at MD&M West

Industry News | 2015-01-22 11:45:39.0

Metcal today announced plans to exhibit in Booth #524 at MD&M West, scheduled to take place Feb. 10-12, 2015 at the Anaheim Convention Center in California. The award-winning Scorpion Rework System will be on display, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.

Metcal

Metcal to Introduce the Scarab Site Cleaning System in Asia at NEPCON China

Industry News | 2015-03-17 16:10:02.0

Metcal today announced plans to exhibit in Booth B-1G26 at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be displayed for the first time in Asia, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.

Metcal

Metcal to Display the Scarab Site Cleaning System at NEPCON South China

Industry News | 2015-07-21 08:12:52.0

Metcal today announced plans to exhibit in Booth B-1G26 at NEPCON South China, scheduled to take place Aug. 25-27, 2015 at the Shenzhen Convention & Exhibition Center. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be on display, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.

Metcal


mid chip balling searches for Companies, Equipment, Machines, Suppliers & Information