Electronics Forum | Sat Oct 08 00:49:59 EDT 2005 | Mika
We do the following things: 1.) RoHS PCB:s is marked with a code. This is to identify that the PCB:s itself are RoHS compliant. 2.) If it is a true RoHS PCBA; we put a printed label with a green "texture" on the PCBA. 3.) If it is a mixed PB free/PB;
Electronics Forum | Tue Dec 20 17:34:28 EST 2016 | dyoungquist
Most reflow ovens will heat up faster than they cool down when changing from 1 profile to another. Run your Pb products first then change over to your Pb Free products. That way you are going from a cooler profile to a hotter one. Going that direc
Electronics Forum | Thu Oct 07 07:58:29 EDT 2010 | scottp
The problem is there are also studies showing reduced reliability. Early thoughts were that if you got complete reflow of both solder materials then you'd be fine, but several studies have shown that there's something going on that's not well unders
Electronics Forum | Fri Feb 10 12:21:44 EST 2006 | Cal Kolokoy
DaveF is correct in saying that TAL is not the best metric to use in reflow soldering. That is why paste manufacturers give such a wide range; typically 30 to 120 seconds. The peak temperature is more important, especially in the mixed Pb and Pb-F
Electronics Forum | Mon Jan 13 17:50:54 EST 2003 | jonfox
I was looking for some good documentation that could nail down some pros/cons of voids, but haven't found any. The biggest issue is if you are going to temp cycle the chips/PCB after assembly. Depending on the cycle, the situation of the test, it c
Electronics Forum | Tue Jun 20 10:15:44 EDT 2006 | samir
Again, the verdict is mixed here as well, but from the seminars, white papers, etc. the consensus seems to be that Pb BGA's are not compatible in a Pb-Free RoHS Process...but... Pb-Free SAC BGA's are compatible in a Sn-Pb process as long as your pro
Electronics Forum | Thu Sep 19 10:22:14 EDT 2013 | rgduval
With the Pb-Free BGA on there, you'll want to use pb-free solder paste for assembly. The logical course of action would be to use Pb-free solder paste for the entire assembly, and to reflow at the temperatures necessary for the BGA and Pb-free paste
Electronics Forum | Thu Mar 09 16:14:23 EST 2006 | operator
We are fixing to run a board with both pb and pb-free BGA's..double sided.. The board is RoHs compliant so I could go either way on the solder paste. I was thinking pb-free paste would be the best bet. Any opinions would be greatly appreciated. Th
Electronics Forum | Wed Mar 16 08:05:30 EST 2005 | wbfranklin
Hello all, I've heard mixed reviews on this subject. Can anyone point out some data on the integrity of lead free parts that are soldered with lead solder. I think that we're probably ALL running into this during this Pb-free transition period. Th
Electronics Forum | Thu Jul 02 17:46:46 EDT 2020 | emeto
There articles about mixed metallurgy and possible quality issues with this kinds of joints. As it is just repair, I would assume it is a local fix, so you should probably go Pb-free paste. If you want to reflow the board I would re-ball the BGA to m
