Electronics Forum | Mon Jul 17 09:09:42 EDT 2023 | tommy_magyar
Things I would check: - solder paste - reflow profile - stencil printing parameters including support, stencil itself and squeegee - MSL procedures - inspection between pick and place and reflow to check paste printing (ideally SPI) Hope this h
Electronics Forum | Fri Mar 09 04:10:18 EST 2012 | grahamcooper22
Hi, I've been supplying Totech dry cabinets in the Uk for 10 years and in that time I've realised the only places to find the correct MSL level is on the dry pack the devices are shipped in or by spending hours on the internet or speaking to the devi
Electronics Forum | Mon Jul 23 08:35:33 EDT 2012 | grahamcooper22
The lower the RH in the MBB the better for all moisture sensitive devices. Maintaining less then 5% will mean no parts of between 2a-5a MSL will need drying before use. The calculation uses 10% because it is a sensible amount of desiccant to use base
Electronics Forum | Thu Nov 20 06:09:00 EST 2014 | jlawson
Anyone have any idea how to use the HLC software > and in particular the Production Planning side > whereby you can cluster a number of sides or > Jobs? I want to fix side 1 of a program and > optimise side 2 around side 1 fixing common parts >
Electronics Forum | Sat Sep 10 17:12:18 EDT 2022 | yannick_herzog
Hello, we use an oven to dry our MSL components after the floor lifes expires. The oven works at 40°C / 0.1% RH. The plan is to upgrade the oven from 40°C to 60°C to shorten the duration of the process. I have found a number of articles mentioning
Electronics Forum | Thu Jan 03 08:01:23 EST 2002 | davef
In addition to a previous poster's comments, you many want to understand moisture sensitive components better. Start with: * J-STD-020 and J-STD-033. Download them here: http://www.jedec.org/download/default.cfm * �Moisture Sensitive Components� R
Electronics Forum | Wed Jun 11 17:16:12 EDT 2003 | MA/NY DDave
Hi I had to poke around awhile to see what you meant. I think you were at an advanced level where IF he knew the MSL ratings of his devices he should constrain his profile within the component mfgs tests for exposure to various profiles, or at leas
Electronics Forum | Fri Feb 17 17:26:56 EST 2006 | mika
Hmm... how about the people inside this room; working in this dry environment? This is something never discussed highly, but I believe it is most certainly important for the human health. This is another interesting thing about RoHS; the side effects
Electronics Forum | Wed Sep 13 09:15:19 EDT 2006 | Rob
Hi Peter, Out of the 1.5 billion components we shipped last year, we had 3 components back for solderability issues. All 3 had been taken out of their vacuum packaging and left to oxidize for a number of weeks. We don't see it as an issue, but we
Electronics Forum | Wed Jan 17 11:30:23 EST 2007 | Colleen Miller
We have some larger MSL3 parts that require baking. they are 6mm thick which takes them off the chart provided at http://www.jedec.org/download/search/jstd033a.pdf Does anyone have a reference that would tell me the baking times for these component
.png)
