Electronics Forum: non wetting and solder profile (Page 8 of 9)

Question about leaded parts used in leadfree soldering process

Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir

Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:28 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

3355-11 Uh oh!

Electronics Forum | Wed Jun 24 13:46:41 EDT 1998 | Chris Kelly

Brian, a couple of things really stick out here... 1) You are spraying what is referred to here at the CATT as "PINK DEATH" The 3355-11 is about the most active/aggressive flux you can get your hands on. I am concerned about both the condition

Solder paste normalisation period

Electronics Forum | Fri Aug 17 06:40:27 EDT 2001 | nifhail

Thanx Dave/Hussman.. We normally store our solder paste in the refrigerator at 0-10 Deg C as per what the supplier recommanded. Our floor temperature is controlled at 22 +/- 5 Deg C and Humidity is at 55 +/- 5%. Recently we have customer asking fo

Re: Solder FINES vs. Solder Balls

Electronics Forum | Thu Apr 15 12:58:59 EDT 1999 | Chrys Shea

| | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | I consider "fines" individual unmelted metal spheres that are foun

Re: Solder FINES vs. Solder Balls

Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau

| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph

Solder Spotting on Gold

Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis

This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder

Re: Solder FINES vs. Solder Balls

Electronics Forum | Thu Apr 15 15:07:20 EDT 1999 | Mark Charlton

| | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | I consider "fines" individual unmelted metal spheres that ar


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