Electronics Forum | Wed Mar 14 00:34:46 EDT 2007 | pyramus
Hi Muhammad thanks for the reply. However, this is my current situation. We are currently using some BGA's with this kind of packaging BGA over BGA. I have verified solderability of the main BGA (below Bga the one w/c will be soldered to PCB) using
Electronics Forum | Wed Jun 09 14:51:08 EDT 1999 | Earl Moon
| Does anyone have thoughts on BGA rework. We now use the OK BGA 3000 and now am considering an Infrared machine. Any thoughts? | I've used Pace, Conceptronic and, now, SRT machines. Bottom side IR is OK. Better thermal balance is achieved with hot
Electronics Forum | Mon Jul 12 13:27:35 EDT 1999 | Upinder Singh
Hi all , We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: 1. Is underfill required for micro-BGAs? 2. What type of stencil apertures are the industry standards for uBGAs and of wha
Electronics Forum | Mon Nov 08 12:47:52 EST 2004 | clampron
Good Day Everyone, I have a BGA rework that has some chipped/damaged solder mask that will need to be repaired prior to BGA replacement. I was wondering what materials are being used in the industry for this type of application. Any help would be g
Electronics Forum | Wed Sep 21 01:57:40 EDT 2005 | hly
Hi K, Thanks for your reply. I was wondering if there is an industry spec that specifies a minimum required solder volume for BGA joints? Thanks HLY
Electronics Forum | Fri Aug 25 08:13:51 EDT 2006 | saaitk
Hi Folks, When temp profiling bga rework how important is thermocouple placement. Have read that holes should be drilled from board underside into ball to accomodate probe (isn't theory wonderful). Probably ok for high volume rework but for 1 or 2 of
Electronics Forum | Mon Apr 16 09:01:18 EDT 2007 | Steve
The best station I've ever worked with is a focused IR station from PDR. The station that I had was called a; "Lightmaster Pro". They have a different model name now, but you can see a datasheet for it at: http://www.pdr.co.uk/Datasheets/PDRX410-IR-
Electronics Forum | Thu May 13 19:43:57 EDT 2004 | My Nguyen
Hello all: We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip) BGA spec. (general) W: 8mm, L: 13mm, H: 1.12 mm, No. of ball: 60, Size: 0.45mm Pitch:
Electronics Forum | Tue Feb 23 09:09:34 EST 1999 | Steve Schrader
| What to look for that causes tombstoning and the corective action. | Check your land-patterns. If they do not meet IPC standards, change your CAD libraries to IPC (or some other industry accepted standards such as SMTPLUS). If you have "home-gr
Electronics Forum | Fri Jul 14 14:26:04 EDT 2017 | davef
How to clean Durostone wave solder pallet? Add date：2016-1-13 Hits：657 Print Back Ultrasonic machines are often used to clean the pallets. This machine is suitable to eliminate the wax, the oil and other stains. With high efficiency, excellent clea
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