Electronics Forum | Tue Aug 02 22:44:42 EDT 2005 | crishan
Thanks for the comments everyone. I did not think of checking the nozzles material, I will check this out. GS, What is PBM, is this some sort of ironiser. Also to clarify, we believe the that the pocket size for the component is too big allowing th
Electronics Forum | Thu Nov 09 22:21:18 EST 2006 | John S.
I would think it would be more productive to compare DPMO. Particularly across different products. A simple board of 20 components should yield much higher than a complex board of 200 components. Also, some consideration should be given to the dif
Electronics Forum | Thu May 28 15:54:45 EDT 2009 | elmerito
Hello, We have designed a 160ball bga substrate. Now we want to use the same substrate for the 145ball version of the product. All are the same, the package size, ball pitch, solder ball size only the number of balls will change. We will use a new s
Electronics Forum | Wed Jan 14 12:48:55 EST 2015 | dyoungquist
MSL rating is not tied to a specific package type/size. I have seen 2 components (ICs) have the same physical package but one was MSL-3 while the other was MSL-5. From my experience, while component manufacturers are not consistent as to where they
Electronics Forum | Tue Feb 17 18:17:28 EST 1998 | John Wilson
I am looking for any information or testing data done on the amount of weight that can be held by a bga package based on size of the solder sphere and number of spheres. I am reflowing components with a bga package on the opposite side and looking f
Electronics Forum | Wed Jul 27 22:43:10 EDT 2005 | crishan
Hi all, Having a major problem with an IC being placed upside down. We pick up the fault at AOI. We have check several reels and the component is not placed upside down by the supplier. Where should I start looking; 1. Are we using an incorrect fee
Electronics Forum | Mon Aug 01 18:33:21 EDT 2005 | crishan
Hi All, We are not using a Vib. bowl feeder, or stick feeder, these parts are on a reel. The pick & place machine we are using is a Panasonic brand YV100X, its a single head with 8 nozzles. What we are finding is that the component package size is
Electronics Forum | Thu Mar 31 12:13:28 EDT 2022 | cbart
That is a tough one because of package size I agree, as noted previously it would be good to know what the current PCB pad layout is. first thought does go right to an adapter board of course! is this a volume build or just 20-50 pcs? dead bug and ha
Electronics Forum | Fri Apr 22 18:17:14 EDT 2022 | swilson
Hello I experiencing major misalignments. I am using a Nichia LED package size@ y=.086,x=0.33mm, with recommended solder pad pattern x.086mm, y=.033. Note here is the kicker the PCB pattern does not meet this requirement. The PCB pad landing is based
Electronics Forum | Fri Dec 01 12:40:04 EST 2000 | Dason C
I agreed with PeteC to use the selective wave pallet, please aware TSSOP is classify as MSL 3. The advantage of the surface mounting allow both package body size and thickness to decrease but also increase the density of the package. Direct heating
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